Startup Funding: April 2023


Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

The Week in Review: IoT


Finance Palo Alto, Calif.-based Armis raised $30 million in Series B funding, bringing total funding for the provider of enterprise Internet of Things security to $47 million. Red Dot Capital Partners of Israel led the round, joined by Bain Capital Ventures. Existing investors Sequoia Capital and Tenaya Capital also participated in the latest funding, which Armis will use to expand sales and m... » read more