Blog Review: Dec. 3


Mentor's Robin Bornoff zeroes in on some of the biggest and most frustrating causes of energy loss—the ones that have nothing to do with the intended task. In electronics, it's a question of how much power is consumed pushing around electrons and photons. Cadence's Richard Goering follows a panel discussion about whether we're really making progress in low-power design, where the challeng... » read more

FinFET Reliability Issues


The 16nm FinFET node has introduced several new challenges in the IC design community. In addition to the complexity of power-noise and electromigration (EM) verification, thermal reliability has become a major concern for both chip and package designers. With the three-dimensional architecture of FinFET devices, new simulation approaches are being used to model thermal behavior of the die in o... » read more

Too Hot To Handle


By Ann Steffora Mutschler It used to be that a device could be designed to a thermal design power. The worst case power scenario would be imagined, and the device would be designed with that in mind. But those good old days are gone. Especially for consumer devices, how a device is going to behave with respect to time, or how people are going to use it, must be understood as completely a... » read more

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