Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
NAND Flash Targets 1,000 Layers
New techniques go beyond improved deposition and etching, but challenges stack up, too.
Testing For Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Auto Chip Aging Accelerates In Hot Climates
New data shows significant reduction in lifespan and potential new security issues as global temperatures rise.
Is In-Memory Compute Still Alive?
It hasn’t achieved commercial success, but there is still plenty of development happening; analog IMC is getting a second chance.
GDDR7 Memory Supercharges AI Inference
High bandwidth and low latency are paramount for AI-powered edge and endpoints.
Hybrid Bonding Makes Strides Toward Manufacturability
Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.
