The Week In Review: Design

By Jesse Allen - 31 Mar, 2017 - Comments: 0

M&A Siemens closed the acquisition of Mentor Graphics, making Mentor now part of Siemens' product lifecycle management (PLM) software business. The $4.5 billion deal, announced last November, brings Siemens into the IC design tool and embedded software markets and expands Siemens' multi-physics and electronic simulation capabilities in the growing digital twin space, which ties together ... » read more

Blog Review: March 29

By Jesse Allen - 29 Mar, 2017 - Comments: 0

In a video, Cadence's Megha Daga introduces how convolutional neural networks identify objects and the wide range of applications for the technology. Mentor's Ron Press proposes a way to take advantage of hierarchical DFT features, even if a design wasn't designed for it. Synopsys' Robert Vamosi shares highlights of the RAND Corporation's extensive report examining zero day vulnerabilitie... » read more

The Week In Review: Design

By Jesse Allen - 19 Aug, 2016 - Comments: 0

Tools Aldec uncorked its TySOM embedded development kit, which includes Riviera-PRO mixed-HDL language simulation for VHDL 2008/Verilog 2005, a Xilinx Zynq-based development board and pre-validated Ubuntu Embedded Host reference designs and tutorials. Mentor Graphics introduced the first phase of its new Xpedition PCB design flow with technologies for design and verification of rigid and ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week In Review: Design

Blog Review: March 29

The Week In Review: Design