tag: e-paper

Power/Performance Bits: Sept. 14

By Jesse Allen - 14 Sep, 2021 - Comments: 0

Thermal management material Engineers at the University of California Los Angeles integrated a new thermal management material, boron arsenide, with a HEMT chip to demonstrate the material's potential. The team developed boron arsenide as a thermal management material in 2018 and found it to be very effective at drawing and dissipating heat. In the latest experiments, they used wide band... » read more

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