Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 Aug, 2018 - Comments: 0

Deals Arm acquired Treasure Data, which offers a data management service. Financial terms weren’t revealed, although the transaction is reportedly worth $600 million. Joyce Kim, Arm’s chief marketing officer, told reporters that the purchase is “the largest cash deal we’ve done.” Along with the company’s introduction of Mbed Cloud (a device management service) last year and the acq... » read more

The Week in Review: IoT

By Jeff Dorsch - 01 Jun, 2018 - Comments: 0

Finance SenseTime of Beijing, China, received $620 million in Series C+ funding, valuing the company at more than $4.5 billion. Alibaba Group led the new funding, as it did with last month’s Series C round of $600 million. Qualcomm, an existing investor, participated in the latest round, along with new investors Fidelity International, Hopu Capital, Silver Lake Partners, and Tiger Global. Se... » read more

The Week in Review: IoT

By Jeff Dorsch - 09 Mar, 2018 - Comments: 0

Finance Toronto-based Ecobee, which markets smart thermostats, raised $61 million in its Series C funding, bringing the total funding for the 11-year-old company to $146 million. Energy Impact Partners led the new round and was joined by Amazon’s Alexa Fund, Relay Ventures, and Thomvest. Ecobee counts Nest Labs, the Google subsidiary, as its chief rival. ThoughtWire, also headquartered in... » read more

Knowledge Centers
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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

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Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

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NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

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Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: Ecobee

Week in Review: IoT, Security, Auto

The Week in Review: IoT

The Week in Review: IoT