Week in Review: IoT, Security, Autos

By Jeff Dorsch - 16 Aug, 2019 - Comments: 0

Products/Services Arm released a survey of 650 industry representatives about eSIM and iSIM technology. Ninety percent of the respondents were aware of eSIM, while 43% were unaware of iSIM. Vincent Korstanje, vice president and general manager, Emerging Businesses at Arm, cites the leading three obstacles to large commercial deployments: Resistance from traditional stakeholders (69% of respond... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Jun, 2019 - Comments: 0

Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 08 Feb, 2019 - Comments: 0

Internet of Things McKinsey & Company identified 10 top trends in the Internet of Things. They include: IoT is a business opportunity, not just a tech opportunity; disciplined execution across multiple use cases is the path to value; and IoT is gradually enabling more subscription business models, but consumers are resistant. Louis Columbus of IQMS provides some IoT data points and id... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Extreme Networks

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto