tag: Gigabyte

Chip Industry Week In Review

By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 25 Mar, 2022 - Comments: 0

Automotive Suzuki will collaborate with SkyDrive on flying cars. SkyDrive is working on an air taxi service that it wants to launch at the 2025 World Exposition in Osaka, Japan. Recalls: The car company Tesla is recalling 947 vehicles in the United States because rearview image lags and does not display immediately when the car is put into reverse, said the National Highway Traffic Safety A... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 Jun, 2020 - Comments: 0

Edge, cloud, data center Synopsys launched its USB4 IP and tools, already with a successful tapeout of a USB4 PHY test chip on 5nm advanced FinFET process. The Designware USB4 IP’s throughput is up to 20 or 40 Gbps, which Synopsys says is the bandwidth needed for high-performance edge AI, storage, PC, and tablet SoC designs. Also, Samsung Foundry certified Synopsys’ Design Compiler NXT for ... » read more

Trending Articles

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

Chip Industry Week In Review

Softbank's acquisition; advanced packaging funding; glass substrates; engineered copper wire; semi equipment set new record; HBM4; AI chips rake in funding; X-ray inspection; apprenticeships.

by The SE Staff

Chip Industry Week In Review

DAC; CHIPS funding; CXL standards; Nexperia investment; US curbs tech investments; Accellera's Federated Simulation Group; European sustainability concerns; SIA's tracking tool; Multibeam's multicolumn litho system.

by The SE Staff

Chip Industry Week In Review

Leading-edge foundry plans; DoD IC center; 300mm funding; Intel's apprenticeship program; metrology and test acquisitions; Keysight's chiplet PHY simulation; thermal management in 3D-ICs; foundry growth.

by The SE Staff

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

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Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

The Race To Glass Substrates

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out.

by Gregory Haley

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Controlling Warpage In Advanced Packages

Mechanical stresses increase with larger sizes and heterogeneous materials.

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Electrically Controlled All-AFM Tunnel Junctions on Silicon with Large Room-Temperature Magnetoresistance (Northwestern)

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Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

by Ed Sperling

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