tag: GlobalFoundries

Limits For TSVs In 3D Stacks?
By Ed Sperling - 06 Oct, 2011 - Comments: 0

By Ed Sperling Semiconductor design always has been about solving technology issues one node at a time, often in the face of a perpetual barrage of looming problems. In fact, if there is any change at all, it’s in the number of threats that have to be solved now at each node, most of them driven by ever-increasing density and the laws of physics. Stacking die holds the promise of becoming... » read more

20nm IP Portability Appears Virtually Impossible
By Ed Sperling - 22 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler Each node on the deep submicron path has brought new challenges to engineering teams, and 20nm is no different. With EUV (extreme ultraviolet) lithography challenges still being worked out, double patterning (DP) instead will be embraced in the manufacturing process most likely until 10nm. Due to the unique nature of DP, IP portability between foundries will become a ... » read more

Experts At The Table: Retrofitting Older Process Nodes
By Ed Sperling - 16 Sep, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; Vishal Kapoor, vice president of marketing for SoC realization at Cadence; Naveed Sherwani, CEO of Open-Silicon; John Heinlein, vice president of marketing at ARM; and Jeff Lukanc, director of engineering at IDT. What follows are excerpts of that conversation, which was held in... » read more

Heat Wreaks Havoc
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ann Steffora Mutschler As semiconductor manufacturing technology has scaled ever smaller, the density of power grid networks has caused on-chip temperatures to rise, negatively impacting performance, power, and reliability. CMOS technology, still the predominant material in SoCs, was originally conceived as a low-power technology when compared with the bipolar approach, which was a very... » read more

Experts At The Table: Retrofitting Older Process Nodes
By Ed Sperling - 08 Sep, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; Vishal Kapoor, vice president of marketing for SoC realization at Cadence; Naveed Sherwani, CEO of Open-Silicon; John Heinlein, vice president of marketing at ARM; and Jeff Lukanc, director of engineering at IDT. What follows are excerpts of that conversation, which was held in... » read more

Experts At The Table: Multi-Foundry Strategies
By Ed Sperling - 22 Aug, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; John Murphy, director of strategic alliances marketing at Cadence; Michael Buehler-Garcia, director of Calibre design solutions marketing at Mentor Graphics; Bob Smith, vice president of marketing and business development at Magma, and Linh Hong, vice president ... » read more

Experts At The Table: Multi-Foundry Strategies
By Ed Sperling - 26 Jul, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; John Murphy, director of strategic alliances marketing at Cadence; Michael Buehler-Garcia, director of Calibre design solutions marketing at Mentor Graphics; Bob Smith, vice president of marketing and business development at Magma, and Linh Hong, vice president ... » read more

Experts At The Table: Are We Cool?
By Ed Sperling - 08 Jul, 2011 - Comments: 0

By Ed Sperling Low-Power Engineering sat to discuss progress in the realm of power management with Ambrose Low, director of IC Design Engineering for Broadcom’s mobile platforms group; Ruggero Castagnetti, distinguished engineer at LSI, and Andy Brotman, vice president of design infrastructure at GlobalFoundries. What follows are excerpts of that conversation. LPE: Has there been any pr... » read more

Different Ways To Boost Yield
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ann Steffora Mutschler In the race to get products to market with shortening product cycles, steepening the ramp to yield is critical. The introductory phase of a product is the point at which margins are highest and market share can be most easily gained. This is no surprise to chipmakers. What is surprising is just how much more difficult it has become to achieve acceptable yield quick... » read more

Experts At The Table: Multi-Foundry Strategies
By Ed Sperling - 27 Jun, 2011 - Comments: 0

By Ed Sperling Semiconductor Manufacturing and Design sat down with Walter Ng, vice president of the IP ecosystem at GlobalFoundries; John Murphy, director of strategic alliances marketing at Cadence; Michael Buehler-Garcia, director of Calibre design solutions marketing at Mentor Graphics; Bob Smith, vice president of marketing and business development at Magma, and Linh Hong, vice president ... » read more

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