tag: GlobalFoundries

Re-Engineering The FinFET
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

The semiconductor industry is still in the early stages of the [getkc id="185" kc_name="finFET"] era, but the [getkc id="26" kc_name="transistor"] technology already is undergoing a dramatic change. The fins themselves are getting a makeover. In the first-generation finFETs, the fins were relatively short and tapered. In the next wave, the fins are expected to get taller, thinner and more re... » read more

Will Materials Derail Moore’s Law?
By Mark LaPedus - 13 Nov, 2014 - Comments: 0

Is Moore’s Law slowing down? Clearly, chipmakers are struggling to keep up with Moore’s Law these days. But one sometimes forgotten and critical technology could easily derail Moore’s Law--materials. In fact, the cost and complexity for electronic materials are increasing at each node. “Chemical and gas commodity procurement spends are growing rapidly due to process complexity and un... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 07 Nov, 2014 - Comments: 0

China’s Jiangsu Changjiang Electronics Technology (JCET) has made a bid to acquire STATS ChipPAC for $780 million, according to reports. This year’s top-20 chip ranking includes two pure-play foundries--TSMC and UMC--and six fabless companies, according to IC Insights. GlobalFoundries is forecast to be replaced in this year’s top 20 ranking by fabless IC supplier Nvidia, according to t... » read more

Design Rules Explode At New Nodes
By Ed Sperling - 03 Nov, 2014 - Comments: 0

Semiconductor Engineering sat down changing design rules with Sergey Shumarayev, senior director of custom IP design at Altera; Luigi Capodieci, R&D fellow at [getentity id="22819" comment="GlobalFoundries"]; Michael White, director of product marketing for Calibre Physical Verification at [getentity id="22017" e_name="Mentor Graphics"], and Coby Zelnik, CEO of [getentity id="22478" e_name=... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 31 Oct, 2014 - Comments: 0

STMicroelectronics announced mixed results for the quarter. The company also launched a plan to cut $100 million in costs. As part of the plan, it is reviewing the implications to its process technology efforts following the recent announcements by its research alliance partners, namely IBM. STMicro is one of the main drivers of FDSOI technology. The company’s FDSOI partner is IBM, which is s... » read more

Applied-TEL Deal Faces Delays
By Mark LaPedus - 29 Oct, 2014 - Comments: 1

Applied Materials’ proposed move to acquire rival Tokyo Electron Ltd. (TEL) faces a possible delay. The blockbuster deal could get pushed out until next year amid a host of complicated regulatory issues. As reported in September of 2013, Applied Materials announced a definitive agreement to acquire TEL in a stock deal valued at around $9.3 billion. Under the terms, Applied Materials would ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 24 Oct, 2014 - Comments: 0

After months of on-again, off-again negotiations, IBM agreed to hand over its Microelectronics unit to GlobalFoundries for $1.5 billion—meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. Analyst Jim McGregor said it is only a matter of time before GlobalFoundries shuts down IBM’s fabs, according to the Albany Business Review... » read more

IBM Unloads Chip Biz To GF
By The SE Staff - 20 Oct, 2014 - Comments: 0

By Ed Sperling & Mark LaPedus After months of on-again, off-again negotiations, [getentity id="22306" comment="IBM"] agreed to hand over its Microelectronics unit to [getentity id="22819" comment="GlobalFoundries"] for $1.5 billion—meaning IBM will actually pay GlobalFoundries that amount to get rid of what has become an albatross for Big Blue. To really sweeten the deal, GlobalFoundr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 17 Oct, 2014 - Comments: 0

It’s official: IBM appears to be exiting the chip business. After months of talks, IBM has agreed to pay GlobalFoundries $1.5 billion to take Big Blue’s chip unit off its hands, according to reports from Bloomberg. IBM will also receive $200 million worth of assets, according to the reports. At the upcoming IEEE International Electron Devices Meeting (IEDM), Intel and IBM will present... » read more

Litho Options Sparse After 10nm
By Mark LaPedus - 16 Oct, 2014 - Comments: 0

Leading-edge foundries are ramping up their 16nm/14nm logic processes, with 10nm and 7nm in R&D. Barring a major breakthrough in [getkc id="80" comment="lithography"], chipmakers will use 193nm immersion and multiple patterning for both 16nm/14nm and 10nm. So now, chipmakers are focusing on the lithography options for 7nm. As before, the options include the usual suspects—[gettech id="... » read more

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