tag: GlobalFoundries

GloFo Says 28nm FD-SOI Die Cost Much Less Than 28nm Bulk HPP
By Various Writers - 17 Jul, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~  ~ According to Shigeru Shimauchi, Country Manager, GlobalFoundries Japan, for the same level of performance, the die cost for 28nm FD-SOI will be substantially less than for 28nm bulk HPP (“high performance-plus”). Specifically, to get a 30%  increase in performance over 28nm bulk LPS PolySiON, HPP increases die ... » read more

Mixed Signals
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Based on the various forecasts for semiconductor equipment, the mood is mixed at this week’s Semicon West trade show in San Francisco. In its mid-year forecast, for example, SEMI predicts that the semiconductor equipment market will reach $36.3 billion in 2013, down 1.7% over 2012. But the business is expected to rebound and reach $43.98 billion in 2014, a 21.2 percent inc... » read more

The Week In Review: July 8
By Mark LaPedus - 08 Jul, 2013 - Comments: 0

By Mark LaPedus Fab tool vendors this week will gather at the annual Semicon West trade show in San Francisco. The mood is expected to be both gloomy and upbeat, at least based on one new and mixed forecast. The semiconductor equipment market is projected to fall 7.4% in 2013, but it will grow 27.1% in 2014, according to VLSI Research. The forecast for semis is up 10% in 2013 and 8.3% growth i... » read more

Foundry Talk
By Ed Sperling - 07 Jul, 2013 - Comments: 0

GlobalFoundries CEO Ajit Manocha sounds off on Foundry 2.0, 450mm wafers, lithography challenges, stacked die, the Internet of Things and the rush to the next process node. [youtube vid=WfjtlZkCi0w] » read more

New Reliability Issues Emerge
By Ed Sperling - 27 Jun, 2013 - Comments: 0

By Ed Sperling Most consumers define reliability by whether a device turns on and works as planned, but the term is becoming harder to define as complexity increases and systems are interconnected. Adding more functionality in less space has made it more difficult to build complex chips, and it has made it more difficult to prevent problems in those chips. Verification coverage is a persist... » read more

The Week In Review: June 21
By Ed Sperling - 21 Jun, 2013 - Comments: 0

By Ed Sperling Mentor Graphics rolled out emulation-ready verification IP for MIPI camera and display-based protocols. The VIP enables stimuli generated by UVM and SystemC-based environments and applies them to a design under test (DUT) running in the emulator. Synopsys introduced a tool for implementing and verifying functional engineering change orders, including matching, visualization ... » read more

Medical Drives Boom In MEMS
By Ed Sperling - 20 Jun, 2013 - Comments: 0

By Mark LaPedus At a recent event, an executive from a startup called Proteus Digital Health described the medical benefits of swallowing the company’s ingestible sensors or digital pills. First, a consumer would swallow Proteus Digital’s tiny ingestible sensor, along with one’s current medication. With no battery or antenna, the stomach fluid generates the power in the ingestible sen... » read more

Inside A 450mm Metrology Consortium
By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 450mm metrology challenges with Menachem Shoval, a former manufacturing executive at Intel and chairman of the Metro450 consortium. The Israeli-based consortium is developing metrology technology for the next-generation, 450mm wafer size. The group consists of Intel, Applied Materials, Jordan Valley, Nanomotion, Nov... » read more

Merchant Photomask Makers Remain Relevant
By Jeff Chappell - 20 Jun, 2013 - Comments: 0

By Jeff Chappell For many years the trend in the semiconductor industry with regard to photomasks and chipmakers was to shed captive mask operations in favor of merchant photomask suppliers. This reflected a larger trend all along the supply chain with many companies moving away from vertical integration as, consequently, the foundry model grew. "This was mainly driven by cost consideratio... » read more

Consortium Mania Sweeps 450mm Landscape
By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus In the mid-1990s, the semiconductor industry embarked on a costly and problematic migration from 200mm to 300mm wafer fabs. At the time, the 300mm development efforts were in the hands of two groups—Sematech and a Japanese-led entity. The equipment industry was on the outside looking in. And as a result, the migration from 200mm to 300mm fabs was out of sync and a nightma... » read more

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