Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 20 Jan, 2023 - Comments: 0

Pervasive computing Keysight Technologies introduced its new Electrical Performance Scan (EP-Scan), a high-speed digital simulation tool for rapid signal integrity (SI) analysis for hardware engineers and printed circuit board (PCB) designers. Siemens Digital Industries Software announced the opening of its eXplore Live at The Smart Factory @ Wichita, housed at Wichita State University’... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 28 Jan, 2022 - Comments: 0

China’s regulators are agreeing to AMD’s acquisition of Xilinx with the caveat that AMD must agree not to force tie-in sales Xilinx's products with AMD products, according to Reuters. China's State Administration for Market Regulation said the companies cannot discriminate against customers using other technology. Xilinx's SEC 8-K form confirms that the two companies received clearance for ... » read more

Week in Review – IoT, Security, Autos

By Jeff Dorsch - 04 Oct, 2019 - Comments: 0

Products/Services Cadence Design Systems is working with Adesto Technologies to grow the Expanded Serial Peripheral Interface (xSPI) communication protocol ecosystem, for use in Internet of Things devices. The Cadence Memory Model for xSPI allows customers to ensure optimal use of the octal NOR flash with the host processor in an xSPI system, including support for Adesto’s EcoXiP octal xSPI ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week in Review – IoT, Security, Autos

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