tag: Intel

Power Limits Of EDA
By Brian Bailey - 13 Oct, 2016 - Comments: 3

Power has become a major gating factor in semiconductor design. It is now the third factor in design optimization, along with performance, and is almost becoming more important than area. But there are limits to the amount of help that [getkc id="7" kc_name="EDA"] can provide with [getkc id="106" kc_name="power optimization"]. Power is not just an optimization problem. It is a design problem... » read more

Seeing The Future Of Vision
By Jeff Dorsch - 13 Oct, 2016 - Comments: 0

Vision systems have evolved from cameras that enable robots to “see” on a factory floor to a safety-critical element of the heterogeneous systems guiding autonomous vehicles, as well as other applications that call for parallel processing technology to quickly recognize objects, people, and the surrounding environment. Automotive electronics and mobile devices currently dominate embedded... » read more

Neural Net Computing Explodes
By Gale Morrison - 06 Oct, 2016 - Comments: 1

Neural networking with advanced parallel processing is beginning to take root in a number of markets ranging from predicting earthquakes and hurricanes to parsing MRI image datasets in order to identify and classify tumors. As this approach gets implemented in more places, it is being customized and parsed in ways that many experts never envisioned. And it is driving new research into how el... » read more

Aftermarket Autonomous Vehicle Race Heats Up
By Ann Mutschler - 06 Oct, 2016 - Comments: 0

It’s not just car companies that are racing to build self-driving vehicles. An entire ecosystem is sprouting up around retrofitting existing vehicles with autonomous technology, despite the fact that the technology, infrastructure, regulatory and insurance issues are still not fully formed. Uber already is using self-driving taxis, accompanied by a human driver, in Pittsburgh, Pa. And many... » read more

Heterogeneous System Challenges Grow
By Ann Mutschler - 03 Oct, 2016 - Comments: 0

As more types of processors are added into SoCs—CPUs, GPUs, DSPs and accelerators, each running a different OS—there is a growing challenge to make sure these compute elements interact properly with their neighbors. Adding to the problem is this mix of processors and accelerators varies widely between different markets and applications. In mobile there are CPUs, GPUs, video and crypto pr... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Sep, 2016 - Comments: 0

Chipmakers In 2016, growth in the pure-play foundry business will be driven by leading-edge processes, according to IC Insights. In fact, the increase in pure-play foundry sales this year is forecast to be almost entirely due to processes at » read more

The Week In Review: IoT
By Jeff Dorsch - 30 Sep, 2016 - Comments: 0

Deals SAP will invest more than $2.2 billion in the Internet of Things by 2020, including acquisitions, and it has formed a new line of business called SAP IoT. The software giant this week reported its purchase of an Italian startup, PLAT.ONE, which will be integrated into SAP IoT. “It is a big and growing market and we think we can be a significant part of it,” said Tanja Rucker, SAP’s... » read more

Packaging Wars Begin
By Mark LaPedus - 26 Sep, 2016 - Comments: 1

The advanced IC-packaging market is turning into a high-stakes competitive battleground, as vendors ramp up the next wave of [getkc id="82" kc_name="2.5D"]/[getkc id="42" kc_name="3D"] technologies, high-density fan-out packages and others. At one time, the outsourced semiconductor assembly and test ([getkc id="83" comment="OSAT"]) vendors dominated and handled the chip-packaging requirement... » read more

The Week In Review: IoT
By Jeff Dorsch - 23 Sep, 2016 - Comments: 0

Security The Industrial Internet Consortium this week unveiled the Industrial Internet Security Framework, a set of specifications for connected health-care devices and hospitals, intelligent transportation, smart electrical grids, smart factories, and other cyber-physical systems in the Internet of Things. AT&T, Fujitsu, Hitachi, Infineon Technologies, Intel, Microsoft, and Symantec are among... » read more

5 Takeaways From BACUS
By Mark LaPedus - 22 Sep, 2016 - Comments: 0

As usual, the recent SPIE Photomask Technology Conference, sometimes called BACUS, was a busy event. The event, which took place in San Jose, Calif., featured presentations on the usual subjects in the photomask sector. There were presentations on mask writers, inspection, metrology, repair and cleaning. And, of course, the papers included masks based on extreme ultraviolet (EUV) lithography... » read more

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