tag: Intel

Sorting Out Next-Gen Memory
By Mark LaPedus - 22 Sep, 2016 - Comments: 8

In the data center and related environments, high-end systems are struggling to keep pace with the growing demands in data processing. There are several bottlenecks in these systems, but one segment that continues to receive an inordinate amount of attention, if not part of the blame, is the memory and storage hierarchy. [getkc id="92" kc_name="SRAM"], the first tier of this hierarchy, is... » read more

Deploying Multi-Beam Mask Writers
By Mark LaPedus - 22 Sep, 2016 - Comments: 3

Elmar Platzgummer, chief executive of IMS Nanofabrication, sat down with Semiconductor Engineering to discuss the company’s deal with Intel, photomasks, multi-beam mask writer technology and other topics. What follows are excerpts of that conversation. SE: This has been a significant year for IMS for two reasons. First, Intel recently announced plans to acquire IMS. Second, at the recent ... » read more

Stacked Die Changes
By Ed Sperling - 21 Sep, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advanced packaging with David Pan, associate professor in the department of electrical and computer engineering at the University of Texas; Max Min, senior technical manager at [getentity id="22865" e_name="Samsung"]; John Hunt, senior director of engineering at ASE; and Sitaram Arkalgud, vice president of 3D portfolio and technologies at Invensas. ... » read more

Executive Insight: Sundari Mitra
By Ed Sperling - 20 Sep, 2016 - Comments: 0

Sundari Mitra, co-founder and CEO of [getentity id="22535" e_name="NetSpeed Systems"], sat down with Semiconductor Engineering to discuss machine learning, shifting from a processor-centric to a memory-centric design, and what needs to change to make that all happen. What follows are excerpts of that conversation. SE: What is the biggest change you’re seeing? Mitra: We go through a cycl... » read more

Plugging Holes In Machine Learning
By Ed Sperling - 19 Sep, 2016 - Comments: 0

The number of companies using machine learning is accelerating, but so far there are no tools to validate, verify and debug these systems. That presents a problem for the chipmakers and systems companies that increasingly rely on machine learning to optimize their technology because, at least for now, it creates the potential for errors that are extremely difficult to trace and fix. At the s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 16 Sep, 2016 - Comments: 0

Chipmakers The finFET market is heating up. GlobalFoundries, Intel, Samsung and TSMC are ramping 16nm/14nm finFETs. And 10nm and 7nm finFETs are in the works. The market will shortly have a new competitor—Taiwan’s United Microelectronics Corp. (UMC). Some years ago, UMC licensed finFET technology from IBM. UMC has been a bit quiet about the 14nm finFET technology, but it has made si... » read more

7nm Market Heats Up
By Mark LaPedus - 15 Sep, 2016 - Comments: 2

The 7nm finFET market is heating up in the foundry business amid the ongoing push to develop chips at advanced nodes. Not long ago, TSMC announced plans to enter the 7nm finFET market. In addition, Intel and Samsung are also separately planning to enter the 7nm finFET race. Now, GlobalFoundries is formally announcing its 7nm finFET technology. Slated for 2018, GlobalFoundries’ 7nm fin... » read more

Power/Performance Bits: Sept. 13
By Jesse Allen - 13 Sep, 2016 - Comments: 0

Core-to-core communication Most research featured in the Power/Performance Bits has far-off applications, but a team from North Carolina State University and Intel developed something that could be brought into practice today: a way to accelerate core-to-core communication. Many important workloads incur significant core-to-core communication and are affected significantly by the costs, i... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 Sep, 2016 - Comments: 0

Chipmakers GlobalFoundries has rolled out its next-generation FD-SOI technology. The new 12nm FD-SOI process is called 12FDX. It is designed for a range of applications, from mobile computing and 5G connectivity to artificial intelligence and autonomous vehicles. "Some applications require the unsurpassed performance of finFET transistors, but the vast majority of connected devices need high l... » read more

The Week In Review: Design
By Jesse Allen - 09 Sep, 2016 - Comments: 0

M&A Intel will acquire Movidius, adding the company's low-power vision processing unit to its growing computer vision efforts that include a depth-sensing camera and machine learning projects. At the same time, Intel is shedding cybersecurity unit McAfee (acquired in 2011 for $7.7 billion and re-named Intel Security in 2014). Intel will retain a 49% stake in the business with the 51% rem... » read more

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