Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 09 Jul, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back The IoT designer Deed designed a screenless health monitor, worn on the wrist, that uses IoT (Internet of Things) building blocks from Infineon Technologies. The Get bracelet interprets hand gestures for making payments, picking up phone calls, turning up or down audio, while it also takes health data and biometrics. The system us... » read more

Week In Review: Design, Low Power

By Jesse Allen - 26 Jul, 2019 - Comments: 0

CEVA acquired the Hillcrest Labs business from InterDigital. Hillcrest Labs supplies software and components for sensor processing in consumer and IoT devices. Hillcrest Labs' MotionEngine sensor processing software already runs on CEVA DSPs (as well as ARM and RISC-V cores) and enables high accuracy 6-axis and 9-axis sensor fusion, dynamic sensor calibration, and application specific features ... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: InterDigital

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week in Review: IoT, Security, Autos