Startup Funding: January 2024

By Jesse Allen - 07 Feb, 2024 - Comments: 0

Big rounds marked January, with three companies raising over $100 million. Quantum computing topped the list, with the company that resulted from the merger of Cambridge Quantum Computing and Honeywell's quantum division raking in the third-largest round for a quantum computing company ever. Another chart-topper was an advanced packaging company that began mass production in its first factor... » read more

Startup Funding: May 2023

By Jesse Allen - 07 Jun, 2023 - Comments: 0

Photonic interconnects were an area of activity in May, with two companies raising funds for what could be much faster chip-to-chip and chiplet-to-chiplet links. Microstructured optics and metasurfaces also drew investment, with four companies creating products for a range of applications from flexible LEDs to multi-wavelength spectral imaging. The large language models that power many gener... » read more

Startup Funding: June 2022

By Jesse Allen - 06 Jul, 2022 - Comments: 0

Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Join Capital

Startup Funding: January 2024

Startup Funding: May 2023

Startup Funding: June 2022

Startup Funding: September 2021