Chiplet Ecosystem Slowly Emerges


Experts at the Table: Semiconductor Engineering sat down to discuss progress and remaining challenges for designing with chiplets with Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice president for product marketing and management at Alphawave Semi; Hee-Soo Lee, HSD segment lead for Keysight; Mick Posner, senior product group director for Cadence’s Compute S... » read more

Chip Industry Week in Review


The U.S. government will grant licenses to NVIDIA and AMD to again sell some AI chips — NVIDIA's H20 GPU and AMD's MI308 — to Chinese companies. TrendForce projects that the availability of NVIDIA chips, in particular, will create a surge in demand from Chinese AI firms and cloud service providers, and boost high-bandwidth memory (HBM) consumption. The move could raise China’s share of... » read more

When Can I Buy A Chiplet?


One year ago, Semiconductor Engineering conducted its first roundtable to find out the true state of the industry for chiplets. At that event, it was stated that no chiplet had ever been reused in a design for which it was not initially intended. How much has changed over the past year? Returning from last year were Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice... » read more

Blog Review: July 16


Synopsys' Bradley Geden and Manoz Palaparthi explain the difference between functional signoff and RTL signoff and why increased SoC complexity means that verification flows must now capture both the intent and the integrity of a design before it can move forward. Cadence's Frank Ferro finds that LPDDR isn't just for mobile devices anymore, with the new LPDDR6 standard bringing increased ban... » read more

AI In Chip Design: Tight Control Required


Executive Outlook: Semiconductor Engineering sat down with a panel of experts to talk about what's needed to effectively leverage AI, who benefits from it, and where software-defined hardware works best, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Ze... » read more

Chip Industry Week In Review


GlobalFoundries plans to acquire MIPS, adding RISC-V processor IP and PPA optimization software capabilities to its foundry offerings. MIPS will continue to operate as a standalone business within GF. The deal is expected to close in the second half of 2025. The EU rolled out new general-purpose AI rules this week to limit copyright infringement, protect public safety, and require transparency... » read more

AI: A New Tool For Hackers, And For Preventing Attacks


Semiconductor Engineering sat down to discuss hardware security challenges, including new threat models from AI-based attacks, with Nicole Fern, principal security analyst at Keysight; Serge Leef, AI-For-Silicon strategist at Microsoft; Scott Best, senior director for silicon security products at Rambus; Lee Harrison, director of Tessent Automotive IC Solutions at Siemens EDA; Mohit Arora, seni... » read more

Blog Review: July 2


Synopsys’ Shankar Krishnamoorthy chats with industry experts about how the combination of AI and software-defined systems is driving a re-evaluation of engineering workflows and why chip, software, and system development must evolve in unison. Siemens’ Jake Wiltgen considers the rapidly evolving and growing challenge of performing DFT verification as designs scale, with complex hierarchi... » read more

Democratizing Design: How The CHIPS Act Is Reshaping EDA And Semiconductor Innovation


After 26 years in the electronics industry, I've witnessed countless technological shifts, but few have been as transformative — or as promising — as what we're experiencing with the CHIPS Act. I spoke at a recent 62nd DAC panel discussion alongside industry colleagues Saverio Fazzari from Booz Allen Hamilton and Vivek Prasad from a non-profit organization established to operate the Nationa... » read more

Mixed Messages Complicate Mixed-Signal


Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

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