Security Tradeoffs: A Difficult Balance


Experts At The Table: Semiconductor Engineering sat down to discuss hardware security challenges, including new threat models from AI-based attacks, with Nicole Fern, principal security analyst at Keysight; Serge Leef, AI-For-Silicon strategist at Microsoft; Scott Best, senior director for silicon security products at Rambus; Lee Harrison, director of Tessent Automotive IC Solutions at Sieme... » read more

Blog Review: Aug. 6


Cadence's Shyam Sharma checks out key features of the LPDDR6 specification, including data transfer speeds that can reach up to 14.4Gbps, two sub-channels per device, metadata built into the data packets, and row hammer mitigation. Synopsys' Frank Malloy and Vincent van der Leest describe the essential role that a hardware root of trust plays in providing a secure foundation for all other se... » read more

Chip Industry Week in Review


The U.S. government announced new import tariff actions and deals this week, including: The EU: 15% tariff on most goods including semiconductors. According to the EU's president, the action excludes semiconductor equipment. Copper: 50% tariff on all imports of semi-finished copper products and intensive copper derivative products, effective Aug. 1, but raw input material is excluded. ... » read more

What Is The Next Generation In RF Circuit Simulation And Optimization?


Throughout a modern radio frequency integrated circuit (RFIC) design and fabrication process, engineers run many types of simulations to verify and validate their decisions, including: electronic circuit simulations RF circuit simulations electromagnetic (EM) simulations thermal simulations and electro-thermal co-simulations post-layout mixed signal (analog and digital) simulat... » read more

How AI Will Impact Chip Design And Designers


Experts at the Table: Semiconductor Engineering sat down to discuss the role and impact of AI in chip design with Chuck Alpert, Cadence Fellow; Sathish Balasubramanian, head of product marketing and senior director for custom IC at Siemens EDA; Anand Thiruvengadam, senior director and head of AI product management at Synopsys; Sailesh Kumar, CEO of Baya Systems; Mehir Arora, head of engineering... » read more

When Standards Enable Chiplets


Semiconductor Engineering sat down and discussed the need for standards to enable an ecosystem for chiplets with Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice president for product marketing and management at Alphawave Semi; Hee-Soo Lee, HSD segment lead for Keysight; Mick Posner, senior product group director for Cadence’s Compute Solutions Group; and Rob Kr... » read more

Blog Review: July 30


Siemens' John McMillan compares 2.5D and 3D-IC technologies and why choosing between them depends on the specific requirements of a product, such as power consumption, thermal constraints, form factor limitations, data bandwidth, and performance-per-watt targets. Cadence's Yeshavanth BN checks out changes in MIPI MPHY 6.0 that increase the data rate and improve the performance of next-genera... » read more

Navigating The Quantum Revolution In A Year Of Transformation


In 2025, which the United Nations has designated as the International Year of Quantum Science and Technology, business leaders face a transformative moment where quantum computing emerges from research labs into commercial applications, which early adopters already demonstrating quantum advantage in practical scenarios. This white paper explores how quantum technologies are revolutionizing key ... » read more

Chip Industry Week in Review


Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Blog Review: July 23


Synopsys' Vincent van der Leest and Mike Borza argue that hardware security is critical for providing the foundational trust, physical protection, and performance enhancements necessary to support software security and prevent leaks of sensitive data and cryptographic keys. Siemens' Shetha Nolke explains why stress matters so much in 3D-ICs and why evaluating it isn't as straightforward as i... » read more

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