Blog Review: July 30

Siemens’ John McMillan compares 2.5D and 3D-IC technologies and why choosing between them depends on the specific requirements of a product, such as power consumption, thermal constraints, form factor limitations, data bandwidth, and performance-per-watt targets.

Cadence’s Yeshavanth BN checks out changes in MIPI MPHY 6.0 that increase the data rate and improve the performance of next-generation UFS for flash memory-based storage and with other high-bandwidth applications.

Synopsys’ Shankar Krishnamoorthy and Yervant Zorian suggest silicon lifecycle management to mitigate the impact of silent data corruption as bigger AI workloads with increased amounts of heat, voltage fluctuations, and noise place unprecedented stress on computational hardware.

Keysight’s Akhilesh Daniel finds that there is increasing demand to study new waveform candidates for 6G that can improve and enhance OFDM (Orthogonal Frequency Division Multiplexing), which was introduced during 4G LTE and further developed in 5G.

Arm’s Suraj Gajendra points to how the ready availability of virtual platforms for development and cloud-based validation can accelerate the development cycle by up to two years and support the emergence of software-defined systems.

Infineon’s Sven Wang introduces synchronous connection-oriented loopback, a testing and debugging technique for wireless audio transmission that routes an audio signal back to the original source to verify the audio transmission quality.

Ansys’ Caty Fairclough shares several testing and validation techniques for the unique challenges faced by autonomous aerospace and defense systems, from in-the-loop testing approaches to digital mission engineering and simulation.

In a blog for SEMI, Radislav A. Potyrailo, Andreas Schütze, Sreeni Rao, Christian Meyer, and Paul Carey explore what gas sensors are, how they are calibrated, what their limitations are, and how the next generation of MEMS-based gas sensors is driving innovation.

Plus, check out the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:

Amkor’s MinJae Kong looks at how to improve the thermal properties and reliability of FCLBGA packages with indium-silver thermal interfaces.

Synopsys’ Wolfgang Demmerle discusses ways to enable mask and process engineers to explore new patterning methodologies and assess alternate scenarios with lithography simulations.

ESDA’s Bob Smith explores how machine learning is having demonstrable effects on the critical metrics important in EDA.

yieldWerx’s Muhammad Rameez Arif points to a gap between modern power systems’ demand for faster switching speeds, higher voltage tolerance, and better thermal efficiency versus what silicon can deliver.

Microtronic’s Mike LaTorraca explains why certain non-killer but marginal wafer defects can escape detection if they have sufficient electrical connectivity.

Lam Research’s QingPeng Wang focuses on the potential to vividly visualize complicated 3D structures with virtual fabrication.

e-Beam Initiative member Reinhard Galler showcases conference presentations that tackle emerging challenges in photomasks and lithography.