Where Is The New Competition?

By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is a regular topic of discussion at semiconductor industry conferences and trade shows. Anyone who has been to these gatherings over the past couple decades can see there are fewer companies presenting and exhibiting, fewer startups taking the place of those that were bought, and a dramatic increase in one-day, one-vendor-sponsored events where top experts are gathered to talk abo... » read more

New Wave Of Consolidation

By Ed Sperling - 22 Nov, 2016 - Comments: 0

Consolidation is picking up again across the semiconductor industry, against a backdrop of looming interest rate hikes, geopolitical uncertainty, and the erosion of longstanding demarcations between markets. In the past couple of weeks, Siemens signed a deal to buy [getentity id="22017" e_name="Mentor Graphics"] for $4 billion, and [getentity id="22865" e_name="Samsung"] purchased Harman, a ... » read more

The Week In Review: IoT

By Jeff Dorsch - 18 Nov, 2016 - Comments: 0

Deals Verizon Communications reported acquiring the assets of LQD WiFi LLC, expanding its smart city portfolio; financial terms weren’t revealed. Mike Lanman, senior vice president, Enterprise Products and Internet of Things at Verizon, said in a statement: “LQD’s Palo technology hubs capture Verizon’s vision of delivering citizen engagement experiences by connecting people with their ... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: LQD WiFi

Where Is The New Competition?

New Wave Of Consolidation

The Week In Review: IoT

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