Chip Industry Week In Review


The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review


By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more