Surface Modification: Solving Semiconductor Manufacturing Challenges


Process reliability and faster technology deployment are two of the most pressing manufacturing challenges currently facing the semiconductor industry. In a world of ever-evolving technology and innovation, engineers are working to transform materials that don’t possess all the desired functions through a method called “surface modification” – the act of modifying a material’s surface... » read more

Era Of 3D Printing Begins


3D printing has always been an interesting side technology. It's now about to become a mainstream technology. Until recently, the majority of applications for this technology have been limited for several reasons. First, there simply isn't enough history to bet the bank on commercial manufacturing using 3D printers. The initial patent for fused deposition modeling was issued in 1986, but ... » read more

One-On-One: Walid Abu-Hadba


Walid Abu-Hadba, chief product officer at [getentity id="22021" e_name="Ansys"] (and a former top executive at Microsoft), sat down with Semiconductor Engineering to talk about systems engineering and why the starting point is no longer the SoC. What follows are excerpts of that conversation. SE: How do you define system? Abu-Hadba: It's everything. It's the entire product and where the p... » read more