The Race To Multi-Domain SoCs

By Ed Sperling - 07 Feb, 2019 - Comments: 0

K. Charles Janac, president and CEO of Arteris IP, sat down with Semiconductor Engineering to discuss the impact of automotive and AI on chip design. What follows are excerpts of that conversation. SE: What do you see as the biggest changes over the next 12 to 24 months? Janac: There are segments of the semiconductor market that are shrinking, such as DTV and simple IoT. Others are going ... » read more

Kumu Networks: Full Duplex on One Channel

By Jeff Dorsch - 03 Jan, 2019 - Comments: 0

Kumu Networks is in an enviable position fitting today’s requirements for radio-frequency system designs. The Sunnyvale, Calif., startup, incorporated in 2011 and coming together the following year, has developed self-interference cancellation technology, enabling radios to send and receive signals at the same time on the same channel or on an adjacent channel. This full-duplex technology has... » read more

Mesh Networking Grows For ICs

By Kevin Fogarty - 04 Apr, 2018 - Comments: 0

Mesh networks were invented to create rich interaction among groups of almost-unrelated peers, but now they are showing up in everything from advanced chip packages to IoT networks. The flexibility of a many-to-many peer-connection model made the mesh approach a favorite for two-dimensional network-on-a-chip topologies, to the point where they began to supplant data-bus connections during th... » read more

Tech Talk: eFPGA Density

By Ed Sperling - 01 Mar, 2018 - Comments: 0

Chen Wang, senior vice president of engineering at Flex Logix, talks about how to improve density in embedded FPGAs. https://youtu.be/Rk0oqzWQr8I » read more

The Week In Review: IoT

By Jeff Dorsch - 21 Jul, 2017 - Comments: 0

Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

Inside Mesh Networks

By Ernest Worthman - 11 Nov, 2015 - Comments: 0

Ad-hoc wireless mesh networks will be the great enabler for the IoE. Part one discusses the technology behind them. Mesh networks have a huge upside when it comes to the Internet of Everything, but there are also some big issues that have to be resolved. “One of the real challenges with mesh networks is there is not a lot of control of the devices that are joining and leaving the networ... » read more

Tech Talk: Mesh Networks

By Ed Sperling - 06 Jul, 2015 - Comments: 0

Yifeng Zhang, director of systems at NXP, discusses problems in connecting home networks and how that's about to change with Bluetooth Low Energy and mesh networking approaches. [youtube vid=zcET06J2Z2k] » read more

Wireless Technologies For The IoE

By Ernest Worthman - 02 Apr, 2015 - Comments: 0

It's generally understood the [getkc id="76" kc_name="Internet of Everything"] eventually will be the interconnect platform of all things, wireless and wireline. The utopian scenario is to have a common platform, with standardized protocols, which everyone builds to. Will that happen? Perhaps, but for a time, especially while the IoE evolves, that won’t be the case. Count on the early IoE bei... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.