Week in Review: IoT, Security, Auto

By Jeff Dorsch - 03 Aug, 2018 - Comments: 0

Deals Arm acquired Treasure Data, which offers a data management service. Financial terms weren’t revealed, although the transaction is reportedly worth $600 million. Joyce Kim, Arm’s chief marketing officer, told reporters that the purchase is “the largest cash deal we’ve done.” Along with the company’s introduction of Mbed Cloud (a device management service) last year and the acq... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 27 Jul, 2018 - Comments: 1

Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

Deep Dive: Energy Efficient Ethernet

By Ed Sperling - 04 Nov, 2010 - Comments: 0

By Pallab Chatterjee In late September, the IEEE ratified the 802.3az Energy Efficient Ethernet (EEE) specification. The standard, and associated test certification specification, was supported by co-development of over 20 commercial products from multiple vendors, of which 13 were release to market simultaneous with the ratification. Wael Diab, from the office of the CTO at Broadcom, and ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Netgear

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Deep Dive: Energy Efficient Ethernet