Chip Industry Week In Review


Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Startup Funding: February 2022


Mega-rounds dominated venture funding in February, with ten companies seeing investment of $100 million or more, five of which exceeded $200 million. Automotive was the big winner, with seven of the ten companies involved in either developing ADAS and autonomous driving, building electric vehicles, or making components to go in cars. The largest round of the month falls into that last category,... » read more