Weird Incidents Reveal L5 Challenges

By Marie C. Baca - 09 Nov, 2022 - Comments: 0

A series of surprising, counterintuitive, and sometimes bizarre incidents reveal the challenges of achieving full Level 5 autonomy in self-driving vehicles, which are an increasingly common site in major cities. While it’s easy to dismiss such anecdotes as humorous glitches compared with the sobering accounts of autonomous tech-related injuries and fatalities, industry executives say these oc... » read more

Startup Funding: June 2022

By Jesse Allen - 06 Jul, 2022 - Comments: 0

Big money went to manufacturing in June, with a massive round for a Chinese analog foundry’s expansion to 55 – 40nm nodes. A fab management software startup also drew sizeable investment, as did a supplier of semiconductor-grade silicon components. Investors didn’t forget chip design, with three EDA companies receiving new funding, one of which drew over $100 million. Plus, numerous te... » read more

Startup Funding: November 2020

By Jesse Allen - 02 Dec, 2020 - Comments: 0

Numerous chipmakers pulled in funding in November 2020, with investors putting money into interconnects, memories, AI hardware, and quantum computing. Launching from stealth was a startup aiming to combine AI and 5G. Autonomous delivery did well, too, with one company raising a massive $500M. This month, we take a look at 28 companies that raised a collective $1.1B. Semi & design Connec... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Weird Incidents Reveal L5 Challenges

Startup Funding: June 2022

Startup Funding: November 2020