Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Jul, 2019 - Comments: 0

Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Mixed Outlook For Fab Equipment

By Christian Dieseldorff - 17 Dec, 2018 - Comments: 0

As 2018 dawned, the semiconductor industry appeared to be poised for a rare fourth consecutive year of equipment investment growth. That rosy outlook is about to change as clouds gather in what until now has been the sunny sky. The latest edition of the World Fab Forecast Report, published by SEMI in December 2018, reveals a downward revision of total fab equipment spending growth for 2018 ... » read more

What’s On Your Holiday Gift List?

By Joanne Itow - 22 Oct, 2015 - Comments: 0

This month Semico reduced our semiconductor growth outlook for 2015 and 2016. The slowdown is mainly due to lower sales of electronic devices such as new convertible notebooks and even smartphones. TSMC reported near-term uncertainty due to higher than seasonal inventories, customers’ cautious inventory management, along with active inventory reductions. The new iPhone 6s and 6s Plus rolled o... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: outlook

Week in Review: IoT, Security, Auto

Mixed Outlook For Fab Equipment

What’s On Your Holiday Gift List?