tag: overlay

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP
By Onto Innovation - 07 Dec, 2020 - Comments: 0

Fan-out wafer level packaging (FOWLP) is a popular new packaging technology that allows the user to increase I/O in a smaller IC size than fan-in wafer level packaging. Market drivers such as 5G, IoT, mobile and AI will all use this technology. According to Yole Développement’s analysis, the fan-out packaging market size will increase to $3 billion in 2022 from $2.44 hundred million in 2014,... » read more

Curvilinear Full-Chip ILT
By Ed Sperling - 17 Oct, 2019 - Comments: 0

Leo Pang, chief product officer and executive vice president at D2S, talks about the speed improvements with full-chip inverse lithography technology, why it is so critical in stitching together large chips, and how this approach differs from traditional litho approaches. » read more

Intra-Field Stress Impact on Global Wafer Deformation
By Veeco - 14 Aug, 2019 - Comments: 0

One of the contributors to layer-to-layer overlay in today’s chip manufacturing process is wafer distortion due to thin film deposition. Mismatch in the film specific material parameters (e.g., thermal expansion coefficients) may result in process-induced warpage of the wafers at room temperature. When these warped wafers are loaded onto the scanner for the next layer exposure, in-plane disto... » read more

Yield Impact For Wafer Shape Misregistration-Based Binning For Overlay APC Diagnostic Enhancement
By KLA - 05 Aug, 2019 - Comments: 0

By David Jayez, Kevin Jock, Yue Zhou and Venugopal Govindarajulu of GlobalFoundries, and Zhen Zhang, Fatima Anis, Felipe Tijiwa-Birk and Shivam Agarwal of KLA. 1. ABSTRACT The importance of traditionally acceptable sources of variation has started to become more critical as semiconductor technologies continue to push into smaller technology nodes. New metrology techniques are needed to pur... » read more

Improved Accuracy And Robustness For Advanced DRAM With Tunable Multi-Wavelength Imaging Scatterometry Overlay Metrology
By KLA - 23 May, 2019 - Comments: 0

By Honggoo Lee, Sangjun Han, Minhyung Hong, Jieun Lee, Dongyoung Lee, Ahlin Choi and Chanha Park of SK Hynix, and Dohwa Lee, Seongjae Lee, Jungtae Lee, Jeongpyo Lee, DongSub Choi, Sanghuck Jeon, Zephyr Liu, Hao Mei, Tal Marciano, Eitan Hajaj, Lilach Saltoun, Dana Klein, Eran Amit, Anna Golotsvan, Wayne Zhou, Eitan Herzl, Roie Volkovich and John C. Robinson of KLA. Abstract Overlay process c... » read more

Variation Issues Grow Wider And Deeper
By Ed Sperling - 24 Jan, 2019 - Comments: 0

Variation is becoming more problematic as chips become increasingly heterogeneous and as they are used in new applications and different locations, sparking concerns about how to solve these issues and what the full impact will be. In the past, variation in semiconductors was considered a foundry issue, typically at the most advanced process node, and largely ignored by most companies. New p... » read more

Matching Between Simulations and Measurements As a Key Driver for Reliable Overlay Target Design
By GlobalFoundries - 15 Nov, 2018 - Comments: 0

By S. Lozenko, B. Schulz, L. Fuerst, C. Hartig, and M. Ruhm of GlobalFoundries and T. Shapoval, G. Ben-Dov, Z. Lindenfeld,  R. Haupt, and R. Wang of KLA-Tencor Abstract Numerical simulation of overlay metrology targets has become a de-facto standard in advanced technology nodes. While appropriate simulation software is widely available in the industry alongside with metrics that allow sel... » read more

In-Cell Overlay Metrology By Using Optical Metrology Tool
By KLA - 26 Oct, 2018 - Comments: 0

By Honggoo Lee, Sangjun Han, Minhyung Hong, Seungyong Kima, Jieun Lee, DongYoung Leea, Eungryong Oh, and Ahlin Choi of SK Hynix, and Hyowon Park, Waley Liang, DongSub Choi, Nakyoon Kim, Jeongpyo Lee, Stilian Pandev, Sanghuck Jeon, John C. Robinson of KLA-Tencor Abstract Overlay is one of the most critical process control steps of semiconductor manufacturing technology. A typical advanced s... » read more

Variation At 10/7nm
By Ed Sperling - 18 Oct, 2018 - Comments: 1

Klaus Schuegraf, vice president of new products and solutions at PDF Solutions, explains why variability is a growing challenge at advanced nodes, why middle of line is now one of the big problem areas, and what happens when a via is misaligned due to a small process variation. https://youtu.be/jQfggOnxZJQ » read more

Spectral Tunability For Accuracy, Robustness And Resilience
By KLA - 16 Aug, 2018 - Comments: 0

In overlay (OVL) metrology the quality of measurements and the resulting reported values depend heavily on the measurement setup used. For example, in scatterometry OVL (SCOL) metrology a specific target may be measured with multiple illumination setups, including several apodization options, two possible laser polarizations, and multiple possible laser wavelengths. Not all possible setups a... » read more

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