Week in Review: IoT, Security, Auto

By Jeff Dorsch - 24 May, 2019 - Comments: 0

Internet of Things The Wing unit of Alphabet this summer will begin making drone deliveries in the Vuosarri district of Helsinki, Finland. The unmanned aerial vehicles will bear food and other items from Herkku Food, a gourmet market, and the Café Monami restaurant. The drones will bear deliveries of up to 3.3 pounds over distances of up to 6.2 miles. Comcast is reportedly developing an in... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Apr, 2019 - Comments: 0

Internet of Things Smart-building technology is a factor in marketing new facilities to prospective tenants. The new Cambridge Crossing development in Cambridge, Mass., aspires to attract tech-oriented tenants much like nearby Kendall Square, this analysis notes. Philips has agreed to lease seven floors in Cambridge Crossing’s first office building, making that location its North American he... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Apr, 2019 - Comments: 0

Internet of Things Microsoft has new services and capabilities for Azure-connected Internet of Things devices. There’s a new IoT security tool called Azure Security Center for IoT, which ties in with other tools within Azure IoT Hub. Azure Security Center for IoT uses Azure Security Center, Microsoft’s threat intelligence offering. The new IoT security tool also hooks into Azure Sentinel, ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

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Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto