Silicon Photonics Comes Into Focus

By Ed Sperling - 31 Oct, 2016 - Comments: 5

Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

Power/Performance Bits: Aug. 4

By Jesse Allen - 04 Aug, 2015 - Comments: 0

Superfast fluorescence Duke University researchers developed an ultrafast light-emitting device, pushing semiconductor quantum dots to emit light at more than 90 gigahertz. This device could one day be used in optical computing chips or for optical communication between traditional electronic microchips. The new speed record was set using plasmonics. When a laser shines on the surface of ... » read more

Power/Performance Bits: March 17

By Jesse Allen - 17 Mar, 2015 - Comments: 0

Artificial photosynthesis: leaves of nickel Inspired by a chemical process found in leaves, Caltech scientists developed an electrically conductive film that could help pave the way for devices capable of harnessing sunlight to split water into hydrogen fuel. When applied to semiconducting materials (it's been tested with silicon, indium phosphide, and cadmium telluride), the team's film ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: plasmonics

Silicon Photonics Comes Into Focus

Power/Performance Bits: Aug. 4

Power/Performance Bits: March 17