tag: Polestar

Chip Industry Week In Review

By The SE Staff - 02 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Chip Industry Week In Review

By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 14 Oct, 2022 - Comments: 0

Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Trending Articles

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

Chip Industry Week In Review

Applied Materials' $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus' U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea's big bet; Apple's processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.

by The SE Staff

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

by Anne Meixner

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

Knowledge Centers
Entities, people and technologies explored

Related Articles

The Rising Price Of Power In Chips

More data requires faster processing, which leads to a whole bunch of problems — not all of which are obvious or even solvable.

by Ed Sperling

Chiplet IP Standards Are Just The Beginning

Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.

by Ann Mutschler

The Future Of Memory

From attempts to resolve thermal and power issues to the roles of CXL and UCIe, the future holds a number of opportunities for memory.

by Karen Heyman

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

Silicon Photonics Manufacturing Ramps Up

The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.

by Gregory Haley

Backside Power Delivery Gears Up For 2nm Devices

But this novel approach to optimizing logic performance depends on advancing lithography, etching, polishing, and bonding processes.

by Laura Peters

X-ray Inspection In The Semiconductor Industry

Utilizing multiple technologies helps create a more complete inspection picture.

by Chris Rand

SRAM Scaling Issues, And What Comes Next

While it will remain a workhorse memory, using SRAM at advanced nodes requires new approaches.

by Karen Heyman

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