tag: ST Engineering

Chip Industry Week In Review

By The SE Staff - 22 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

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Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

by Laura Peters

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Not all chiplets are interchangeable, and options will be limited.

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Chip Industry Week In Review

Applied Materials' $4B facility at risk; AI chip bonanza; Japan, U.S. alliance; Rapidus' U.S. subsidiary; EDA revenue up; TSMC $6.6B funding; Infineon, Amkor team up; S. Korea's big bet; Apple's processor overhaul; high-NA EUVL defect system; chiplet HW security module; new Spectre attack.

by The SE Staff

Architecting Chips For High-Performance Computing

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.

by Ann Mutschler

EDA Looks Beyond Chips

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.

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More data requires faster processing, which leads to a whole bunch of problems — not all of which are obvious or even solvable.

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Chiplet IP Standards Are Just The Beginning

Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.

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The Future Of Memory

From attempts to resolve thermal and power issues to the roles of CXL and UCIe, the future holds a number of opportunities for memory.

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Silicon Photonics Manufacturing Ramps Up

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Backside Power Delivery Gears Up For 2nm Devices

But this novel approach to optimizing logic performance depends on advancing lithography, etching, polishing, and bonding processes.

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X-ray Inspection In The Semiconductor Industry

Utilizing multiple technologies helps create a more complete inspection picture.

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SRAM Scaling Issues, And What Comes Next

While it will remain a workhorse memory, using SRAM at advanced nodes requires new approaches.

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