Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Dec, 2018 - Comments: 0

Internet of Things Arm made five 2019 predictions for the Internet of Things. They are: The intelligent home goes mainstream; personalized delivery options; improved health-care service; smart cities seek to improve revenue streams and citizen engagement; and smart buildings use more technology for efficiencies. The company also commissioned a worldwide survey of 2,000 consumers, conducted by ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Oct, 2018 - Comments: 0

Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

The Week In Review: IoT

By Jeff Dorsch - 18 Aug, 2017 - Comments: 0

Connectivity Longing for LightSquared? The once-bankrupt company that tried to build a network with satellite airwaves and traditional spectrum has been reborn as Ligado Networks, which wants to serve 5G and Industrial Internet of Things applications with a mobile data network, employing satellite communications and other resources. Its founder is Philip Falcone, who was the guiding force behi... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

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tag: Super Micro Computer

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

Week in Review: IoT, Security, Auto

The Week In Review: IoT

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