Chiplets And 3D-ICs Add New Electrical And Mechanical Challenges


Key Takeaways • Chiplets and 3D-IC architectures add new thermal-mechanical stresses that can affect the reliability of entire systems. • As chiplets are assembled into packages, defectivity targets become more stringent for each component in a system. • Traditional silos are breaking down, forcing design teams to address issues such as materials choices that previously were handled by... » read more

Mini-Consortia Forming Around Chiplets


Mini-consortia for chiplets are sprouting up across the industry, driven by demands for increasing customization in tight market windows and fueled by combinations of hardened IP that have been proven in silicon. These loosely aligned partnerships are working to develop LEGO-like integration models for highly specific applications and end markets. But they all are starting small, because it'... » read more