Lots Of Little Knobs For Power


Dynamic power is becoming a much bigger worry at new nodes as more finFETs are packed on a die and wires shrink to the point where resistance and capacitance become first-order effects. Chipmakers began seeing dynamic power density issues with the first generation of [getkc id="185" kc_name="finFETs"]. While the 3D transistor structures reduced leakage current by providing better gate contro... » read more

What’s Missing In Packaging


The growth of advanced packaging on the leading edge of design is inching backwards into older nodes. With most technology—tools, methodologies, materials and processes—this is business as usual. But in packaging, it's both counterintuitive and potentially problematic. The main reason that companies began investing in advanced packaging—OSATs, foundries, chipmakers such as Intel and Qu... » read more

2017 ITC Wrap-up


Advantest was among the exhibitors and corporate sponsors at last week’s 2017 International Test Conference in Fort Worth, Texas. The automatic test equipment company also presented papers, took part in sessions, and provided posters during ITC’s technical program. In the booth, Advantest demonstrated its on-demand CloudTesting Service. It also showed off its EVA100 analog/mixed-signal IC t... » read more

STMicroelectronics’ Implementation Of The STAR Hierarchical System And IEEE 1500 Wrapping


This white paper discusses various IEEE 1500 architectures that STMicroelectronics has deployed using the Synopsys DesignWare STAR Hierarchical System test solution. STAR Hierarchical System allows users to optimize test time on system-on-chips that use multiple cores. The white paper provides guidelines on interface IP wrapping with IEEE 1500 to improve test time. In addition, it discusses the... » read more

High Performance, Low Power, And Test: DFT’s Impact On System PPA And Safety


Back in the day, test was an afterthought in system design and implementation. It was a separate task that could be added to the end of a project schedule—essentially, a checkbox before sending a design for manufacture or during product qualification. Nowadays, test is no longer an afterthought, and we’ll see it continue to grow in importance. Safety-critical semiconductor applications h... » read more

Improving Yield, Reliability With Data


Big data techniques for sorting through massive amounts of data to identify aberrations are beginning to find a home in semiconductor manufacturing, fueled by new requirements in safety-critical markets such as automotive as well as the rising price of packaged chips in smartphones. Outlier detection—the process of finding data points outside the normal distribution—isn't a new idea. It ... » read more

The 2017 International Test Conference


Machine learning is a hot topic at many technical conferences this year. It will be true at the upcoming International Test Conference, which opens near the end of this month in Fort Worth, Texas. On Sunday, October 29, there are two tutorials devoted to machine learning. Monday, October 30, will have one tutorial related to the topic. The conference gets fully under way on Halloween, wit... » read more

Is It Safe To Assume That All “Passed” Die Are Actually “Good” Die?


In a world where Quality and Brand Protection is King, as certainly is the case for the automotive and medical device industries where strict minimal DPPM (defective parts per million) requirements are a common constraint, new methods for “escape” prevention and outlier detection are constantly being evaluated and implemented by semiconductor vendors to prevent any defective or marginal par... » read more

Thunderbolt 3 Remote Control Of PXI Test Systems


The new PXIe-8301 remote control module is the industry’s first solution for laptop control of PXI systems using Thunderbolt 3 technology. With its contemporary connectivity and low cost, the PXIe-8301 makes high-performance control of PXI systems more accessible and affordable to engineers performing benchtop characterization and validation or developing portable automated test systems. T... » read more

How To Make Autonomous Vehicles Reliable


The number of unknowns in automotive chips, subsystems and entire vehicles is growing as higher levels of driver assistance are deployed, sparking new concerns and approaches about how to improve reliability of these systems. Advanced Driver Assistance Systems (ADAS) will need to detect objects, animals and people, and they will be used for parking assistance, night vision and collision avoi... » read more

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