Startup Funding: July 2022

By Jesse Allen - 03 Aug, 2022 - Comments: 0

Quantum computing may seem like a futuristic technology, but computation based on superposition and entanglement is here and investors are eager to get behind it. Two of July's rounds that passed the $100 million mark were for superconducting quantum processor companies, one of which is also developing EDA software to assist in designing quantum circuits. And it's not just mega-rounds. Two quan... » read more

Startup Funding: January 2022

By Jesse Allen - 02 Feb, 2022 - Comments: 0

China's startups are the star of the month once again, with more companies based or co-headquartered in the country receiving funding in January 2022 than the rest of the world combined. Exact investment figures for Chinese startups are frequently not reported, but based on minimum amounts given, they raised more than the rest of the world as well. The largest round of the month went to a co... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 27 Jul, 2018 - Comments: 1

Automotive Tech Marvell Technology Group opened its automotive electromagnetic compatibility lab in North America. The facility is CISPR 25-qualified and gives the chip company the capability to conduct in-house electrostatic discharge, emission, and immunity testing. Marvell also reported that its 88Q2112 offering received a mark of 100% in conformance testing outlined by the Japan Automotive... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

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by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

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Startup Funding: July 2022

Startup Funding: January 2022

Week in Review: IoT, Security, Auto

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