The Week in Review: IoT

By Jeff Dorsch - 09 Mar, 2018 - Comments: 0

Finance Toronto-based Ecobee, which markets smart thermostats, raised $61 million in its Series C funding, bringing the total funding for the 11-year-old company to $146 million. Energy Impact Partners led the new round and was joined by Amazon’s Alexa Fund, Relay Ventures, and Thomvest. Ecobee counts Nest Labs, the Google subsidiary, as its chief rival. ThoughtWire, also headquartered in... » read more

Security For Embedded Electronics

By Jeff Dorsch - 02 Nov, 2017 - Comments: 0

The embedded systems market is expected to enjoy steady growth in the near future—provided those systems can be adequately secured. One of the biggest challenges for embedded devices and systems, especially those employed in the [getkc id="76" comment="Internet of Things"], is adequately protecting them from increasingly sophisticated hacking. This is a new tool for criminal enterprises, a... » read more

Is Security All Talk?

By Ed Sperling - 03 Nov, 2016 - Comments: 0

Security is the No. 1 recurring theme at conferences these days. And given the explosion in the number of conferences this year—up to a half dozen some weeks just in Silicon Valley—that's a lot of attention being showered on security. At nearly all of these talks, there is at least a mention about recent breaches, pervasive and persistent risks, and the growing threat level. The topic of... » read more

Is Security A Priority?

By Ed Sperling - 10 Aug, 2016 - Comments: 0

Ask any two executives in the semiconductor industry about security threats and there is a good chance you will get two totally different answers. The disturbing part is they both may be right. In markets where there is no physical danger to people, security always has been viewed a risk versus profit equation. At conferences over the past year, numerous executives have touted the Transport... » read more

Security Improvements Ahead

By Ed Sperling - 10 Nov, 2015 - Comments: 0

After nearly two years of talking about how security is one of the biggest problems facing the IoE, progress is being made on a number of fronts. The changes involve many companies, both individually and collaboratively through standards groups. And while none of this will stop the kind of high-profile breaches that affected Target or Home Depot or JPMorgan Chase or a long list of other gian... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.