Chip Industry Week In Review


Advanced nodes and packaging AMD announced more than $10B in Taiwan ecosystem investments to scale advanced packaging manufacturing for AI infrastructure. The effort includes EFB-based 2.5D packaging collaborations with ASE and others. AMD also announced the start of its production ramp of its Venice processors on TSMC's 2nm process. Lam Research established a panel-level packaging cen... » read more

Startup Funding: September 2022


The onshoring and buildout of dozens of fabs, many costing tens of billions of dollars, is beginning to spill over into other areas that are critical for chip manufacturing. Materials, in particular, which often gets little attention outside of chip manufacturing, witnessed a big spike in September 2022. In fact, seven materials companies covered in this report made up more than a third of the ... » read more

The Week In Review: Design


M&A Synopsys acquired one-time programmable non-volatile memory IP provider Kilopass. Founded in 2001, Kilopass' 1T and 2T bitcell IP supports up to 4-Mbit OTP instances in 180-nm to 7-nm process technologies. The acquisition will add to Synopsys' growing OTP NVM portfolio: last October, Synopsys acquired Sidense, another provider of the technology. Terms of the deal were not disclosed. ... » read more