Balancing AI And Engineering Expertise In The Fab


Modeling and simulation are playing increasingly critical roles in chip development due to tighter process specs, shrinking process windows, and fierce competition to bring technologies to market first. Before a new device makes it to high-volume manufacturing, there are countless engineering hours spent on developing the lithography, etching, deposition, CMP, and many other processes, at hi... » read more

Wafer Cleaning Becomes Key Challenge In Manufacturing 3D Structures


Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these new 3D structures — some on the horizon but some already in high-volume manufacturing — semiconductor wafer equipment and materials suppliers in the wet cleaning business are at the epicenter... » read more