Chip Industry Week In Review

By The SE Staff - 08 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

3D Connection Artifacts In PDN Measurements

By Cadence - 28 Feb, 2024 - Comments: 0

Authors: Ethan Koether, Amazon; Kristoffer Skytte, John Phillips, Shirin Farrahi, Cadence; Joseph Hartman, Oracle; Sammy Hindi, Ampere Computing Inc.; Mario Rotigni, STMicroelectronics; Gustavo Blando, Istvan Novak, Samtec From a simulation stand-point, we have covered several important topics that users must consider in detail to get accurate low frequency simulation results. We investigate... » read more

Chip Industry Week In Review

By The SE Staff - 26 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

Chip Industry Week In Review

By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

For SDVs, Software Is The Biggest Challenge

By John Koon - 02 Nov, 2023 - Comments: 0

Software-defined vehicles (SDVs) involve far more than just OTA applications enabling software upgrades over the air. Software that will manage hundreds of ECUs and other functions within the vehicle is expected to grow beyond hundreds of millions of lines of code, possibly making SDV software development the number one challenge in automotive design. The benefits of SDVs, such as easy updat... » read more

Chip Industry Week In Review

By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 07 Jul, 2023 - Comments: 0

Joby Aviation and Alef Automotive each received a Special Airworthiness Certificate from the U.S. Federal Aviation Administration (FAA) for an electric vertical take-off and landing (eVTOL) aircraft. Joby will now begin flight testing the prototype, and the aircraft will move to Edwards Air Force Base in 2024 as part of a contract with the U.S. Air Force. Alef’s model is the first U.S. govern... » read more

Blog Review: June 21

By Jesse Allen - 21 Jun, 2023 - Comments: 0

Synopsys' Vikram Bhatia identifies four trends driving the migration of EDA tools and chip design workloads to the cloud, from ever-increasing compute and time-to-market demands to advanced cybersecurity features. Cadence's Veena Parthan checks out how computational fluid dynamics and finite element analysis can help improve aquaculture with sustainable fish cage nets that minimize stagnatio... » read more

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tag: Amazon

Chip Industry Week In Review

3D Connection Artifacts In PDN Measurements

Chip Industry Week In Review

Chip Industry Week In Review

For SDVs, Software Is The Biggest Challenge

Chip Industry Week In Review

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Blog Review: June 21

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