Building Faster Chips

By Ed Sperling and Jeff Dorsch An explosion in IoT sensor data, the onset of deep learning and AI, and the commercial rollout of augmented and virtual reality are driving a renewed interest in performance as the key metric for semiconductor design. Throughout the past decade in which mobility/smartphone dominated chip design, power replaced performance as the top driver. Processors ha... » read more

Executive Insight: Grant Pierce

Grant Pierce, president and CEO of Sonics, sat down with Semiconductor Engineering to discuss new ways to increase energy efficiency in SoCs. What follows are excerpts of that conversation. SE: Looking out at the semiconductor industry there are a lot of changes underway right now. What are the biggest impacts from your perspective? Pierce: The amount of data that is being captured or sen... » read more

Near-Threshold Computing

The emergence of the Internet of Things (IoT) has brought a lot of attention to the need for extremely low-power design, and this in turn has increased the pressure for voltage reduction. In the past, each new process node shrunk the feature size and lowered the nominal operating voltage. This resulted in a drop in power consumption. However, the situation changed at about 90nm in two ways. ... » read more

An Introduction to Reducing Dynamic Power Using PowerPro

At many companies, the job of power reduction is left to power experts. These experts have built up knowledge and methodologies over many years, which they repeatedly apply to designs in their groups. This approach is very narrow and it not scalable across multiple groups in the company. Companies have begun to realize the limitations of this approach. More and more RTL designers are being task... » read more

Plotting The Next Semiconductor Road Map

The semiconductor industry is retrenching around new technologies and markets as Moore's Law becomes harder to sustain and growth rates in smart phones continue to flatten. In the past, it was a sure bet that pushing to the next process node would provide improvements in power, performance and cost. But after 22nm, the economics change due to the need for multi-patterning and finFETs, and th... » read more

An Introduction To Reducing Dynamic Power

In the past few blogs we have been primarily talking about UPF and applying the Successive Refinement process to save power. But, this process addresses leakage power. In this session we want to talk about how to save dynamic power. As designs move to finFET technology, dynamic power is the dominant contributor to power consumption. Power consumption trend. I recently sat down with my c... » read more

2016 And Beyond

Greek mythology and Roman history are replete with soothsayers, some of whom got it right and others wrong. Cassandra was cursed that her predictions wouldn’t be believed, even though she predicted the Trojan horse. Caesar’s soothsayer predicted the demise of Julius Caesar during the Ides of March, which Caesar himself was skeptical about, but indeed he was murdered before the Ides passed. ... » read more

Tech Talk: 14nm And Stacked Die

Aashish Malhotra, marketing director for the ASIC Business Unit at GlobalFoundries, talks about 14nm process technology, the IP ecosystem, and why that technology node will be used as a platform for 2.5D and 3D stacked die across a wide range of markets including the Internet of Everything. [youtube vid=ukTRuedB7ZU] » read more

Doing More With RTL Power Analysis: Smart Synthesis Architecture

Traditionally RTL power analysis has been used to understand the design power consumption so that package and power supply designs can start, and designers can then fix any power regression violations in subsequent design iterations. However, migration to finFET processes is causing designers to look at RTL power analysis differently at advanced nodes. FinFET processes have largely addressed... » read more

Moore’s Law Reset?

GlobalFoundries today took the wraps off its 22nm FD-SOI process, promising to extend Moore's Law technologically without altering the economic equation—at least for the next couple of process nodes. Subramani Kengeri, vice president of global design solutions at [getentity id="22819" comment="GlobalFoundries"], said 22nm FD-SOI will provide the same 30% improvement in PPA that has been c... » read more

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