Cloud vs. Edge Gaming: Performance Gap Is Shrinking
By Liz Allan - 04 Sep, 2025 - Comments: 0

Chip designers and gaming companies are scrambling to figure out whether the gaming market will tilt toward the cloud, the edge, or some combination of both. Multi-gigabit internet allows more people to play high-end games in the cloud, but edge-based gaming consoles and devices remain well-rooted, more secure, and private. Which one wins? So far, there are more questions than answers. Handh... » read more

Security Requirements And Penalties Grow For Chipmakers
By Ed Sperling - 04 Sep, 2025 - Comments: 0

Governments and systems companies are fundamentally changing the rules around semiconductor security, forcing chipmakers and their suppliers to comply with tough new regulations that require resiliency in hardware. Unlike in the past, chips and systems deployed in these markets must be able to respond to threats rather than waiting for the next version of a chip or IP to address vulnerabilities... » read more

Wafer-Scale Heterogeneous Integration of Lithium Tantalate Films on Low-Loss Silicon Nitride Photonic ICs (EPFL, KIT, CAS, IPQ)
By Technical Paper Link - 03 Sep, 2025 - Comments: 0

A new technical paper titled "Heterogeneously integrated lithium tantalate-on-silicon nitride modulators for high-speed communications" was published by researchers at EPFL, Chinese Academy of Sciences, IPQ and KIT. Abstract "Driven by the prospects of higher bandwidths for optical interconnects, integrated modulators involving materials beyond those available in silicon manufacturing incre... » read more

Challenges In Stacking HBM
By Ed Sperling - 03 Sep, 2025 - Comments: 1

AI data centers are pushing for higher density in high-bandwidth memory. Today, the maximum number of layers that can be stacked is 8, but that increases to as many as 24 layers by 2030. The big challenge will be in the interconnects, and making sure the microbumps align. At 16 layers, the bump pitch will be less than 10 microns, and the dies will be thinner. Damon Tsai, head of product marketi... » read more

Enabling Secure 5G Standalone (SA) Core Deployments
By Keysight - 03 Sep, 2025 - Comments: 0

5G SA introduces a fundamentally new, cloud-native, service-based core architecture that enables exceptional performance, agility, and dynamic service delivery. It marks a departure from legacy 4G LTE and 5G Non-Standalone (NSA) models, offering enhanced flexibility and scalability to support diverse use cases through features like network slicing and rapid service innovation. However, this ... » read more

PCB Modularity Reuse and Scale
By Cadence - 03 Sep, 2025 - Comments: 0

In a world of shrinking timelines and growing complexity, modularity isn't a luxury—it's a necessity. This eBook explores how PCB designers can move from one-off designs to scalable systems by rethinking schematics, embracing abstraction, and designing for reuse. What you’ll learn: How modular thinking drives scalability Why abstraction accelerates hardware design How to ap... » read more

The Criticality of Performance per Watt Optimization for AI Chip Development
By Synopsys - 03 Sep, 2025 - Comments: 0

Chip developers are seeing an urgent rise in demand for compute processing capability driven by AI workloads. This increase in compute requirements drives a corresponding increase in the demand for power consumption. For example, a ChatGPT query requires nearly 10 times as much power, on average, as a Google search. Power has traditionally been treated as a secondary constraint, with perform... » read more

Calibre 3DStress: Advanced Stress Analysis For Reliable 3D IC Design
By Siemens EDA - 03 Sep, 2025 - Comments: 0

As the industry transitions toward advanced 3D IC architectures and heterogeneous integration, managing thermo-mechanical stress is essential for product quality and long-term reliability. Calibre 3DStress enables design and packaging teams to simulate, analyze and disposition stresses imparted on the chip during or after the packaging process, ensuring that potential failure risks—such as wa... » read more

MACsec Fundamentals Securing Data in Motion: 2025
By Rambus - 03 Sep, 2025 - Comments: 0

For end-to-end security of data, it must be secured both when at rest (stored on a connected device) and when in motion (communicated between connected devices). For data at rest, a hardware root of trust anchored in silicon provides that foundation upon which all device security is built. Similarly, MACsec (Media Access Control) security anchored in hardware at the foundational communication l... » read more

Blog Review: September 3
By Jesse Allen - 03 Sep, 2025 - Comments: 0

Cadence's Sriram Sharma Kalluri compares convolutional neural networks (CNNs) and transformers to show how their different architectures give them particular strengths and why the choice between them depends on the specific task, the available data, and the computational resources. Siemens' John McMillan provides a primer on the major IC package types, how they influence system design, therm... » read more

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