On-Die And In-Package Interconnects: eBook

By Bryon Moyer - 28 Jul, 2025 - Comments: 0

We live in the Information Age, but if information cannot get to where it's intended to go, it does no good. And the way information gets from here to there is through interconnects. This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re constructed. As always, we consider the design, test, reliability, and security impli... » read more

Chip Industry Week in Review

By The SE Staff - 25 Jul, 2025 - Comments: 0

Intel reported flat year-over year revenue for Q2, exceeding Wall Street's pessimistic expectations. In a message to employees, CEO Lip-Bu Tan said the company will: Cut about 15% of its staff, ending the year with about 75,000 employees, down from a high of nearly 132,000 in 2022; Scrap projects in Poland and Germany, consolidate other sites in central America and Southeast Asia, and s... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces

By MinJae Kong - 24 Jul, 2025 - Comments: 0

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

GPU Acceleration Of Rigorous Lithography Simulations

By Wolfgang Demmerle - 24 Jul, 2025 - Comments: 0

Producing modern semiconductor devices is an immensely challenging process. Successful execution entails advanced process nodes, novel device architectures, new materials, and many fabrication steps. One especially challenging area is lithography, in which light is sent through a photomask, passes through a projection system of lenses and mirrors, and strikes the substrate to create the device ... » read more

AI, Product Lifecycle Management, Market Dynamics: Q&A With Jay Vleeschhouwer Of Griffin Securities 

By Bob Smith - 24 Jul, 2025 - Comments: 0

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction. His presentation on the State of EDA is standing room only at the yearly Design Automation Conference (DAC). He recently agreed to a discussion with me where we talked about AI and EDA, an interesting development with product lifecycle management and global dynamics af... » read more

The Race To Replace Silicon

By M. Rameez Arif - 24 Jul, 2025 - Comments: 1

For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

Marginal Wafer Defects Can Slip Past Electrical Testing

By Errol Akomer - 24 Jul, 2025 - Comments: 0

Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not guarantee that chips will not fail in the field. Certain non-killer but marginal wafer defects can still slip through electrical testing if they have sufficient electrical connectivity, even thou... » read more

The Rise Of Panel-Level Packaging

By Laura Peters - 24 Jul, 2025 - Comments: 0

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum reticle size in the next few years. These assemblies are best developed using fan-out panel-level packaging, replacing today’s wafer carrier with a panel. Fan-out packaging enables substantially... » read more

Semiconductor Virtual Fabrication And Its Applications

By Qingpeng Wang - 24 Jul, 2025 - Comments: 0

Semiverse Solutions, particularly SEMulator3D, can enhance semiconductor engineering in several ways. SEMulator3D is a software platform for semiconductor process modeling and virtual fabrication.1 Prototyping and visualization: Virtual fabrication aids in understanding and visualizing complex semiconductor structures in three dimensions, facilitating better design and prototyping. Unit... » read more

Semiconductor Manufacturing Cybersecurity Consortium (SMCC)—SEMI E187 Compliance Guidance Report

By SEMI - 24 Jul, 2025 - Comments: 0

Cyber threats continue to increase at alarming rates, for instance according to Forbes, 2023 saw a 72% increase in data breaches since 2021, which held the previous all-time record and The Federal Bureau of Investigation’s (FBI) 2023 Internet Crime Report further revealed an 81% rise in financial losses due to cybersecurity complaints, escalating from $6.9 billion to $12.5 billion. The FBI re... » read more

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