Enabling Physical AI and Robotics: Platform for the Intelligent Edge
By Synaptics - 01 Apr, 2026 - Comments: 0

Physical AI has emerged as an essential technology driving the future of robotics — it closes the loop between perception, reasoning, and action in the real world using powerfully trained AI models. But for robots and autonomous machines, that loop only works well if it runs where the world is actually sensed: at the Edge. Instead of streaming raw sensor data to a data center for interpretati... » read more

Ensuring Trustworthiness of AI-Enhanced Embedded Systems
By Infineon - 01 Apr, 2026 - Comments: 0

Artificial Intelligence (AI) is unlocking new capabilities in safety-critical systems, from enhanced motor control to autonomous driving. However, integrating AI safely remains a significant challenge due to its data-driven nature and operation in open and real-world variability. While established standards such as ISO 26262 and ISO 21448 provide a foundation for functional safety and intended ... » read more

Accelerating Automotive Innovation: SRAM Compiler Breakthroughs for 5nm and 3nm SoCs
By Synopsys - 01 Apr, 2026 - Comments: 0

Modern automotive SoCs must deliver extreme performance, functional safety, and long‑term reliability — all under growing power and thermal constraints. This white paper explains how next‑generation Synopsys SRAM Compiler IP for TSMC N5A and N3A helps design teams meet these challenges with measurable gains in PPA, reliability, and system robustness. Why Read this White Paper: See... » read more

Hardware Deployment for Secure AI Using Confidential Computing
By Rambus - 01 Apr, 2026 - Comments: 0

AI’s fast evolution is producing autonomous systems that can operate with minimal human oversight, improve themselves and become effective at decision-making in complex environments. These developments require careful consideration of security and privacy. To limit the overhead performance impact (area, throughput, latency and power), hardware-based security solutions can be deploye... » read more

Radar SLAM Application on Vision DSPs based on Novel IO-ICP
By Cadence - 01 Apr, 2026 - Comments: 0

With the increasing use of vision, radar and LiDAR in autonomous vehicles, robots, drones, and augmented reality, there is a greater demand for the capability and performance of multimodal sensing applications. This demand requires sophisticated multi-sensing algorithms and powerful digital signal processors (DSPs) to run them. Simultaneous localization and mapping (SLAM) has revolutionized ... » read more

Blog Review: April 1
By Jesse Allen - 01 Apr, 2026 - Comments: 0

Siemens EDA's Harry Foster considers why first-silicon success is continuing to decline even though tools are capable of handling much larger design sizes and identifies how increasingly complex interactions between components cause traditional verification assumptions to break down. Synopsys' Eldo N Baby explores dynamic voltage drop analysis, including how to bring in switching scenario in... » read more

AI’s Potential And Limitations In Chip Design
By Ed Sperling - 01 Apr, 2026 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the opportunities and challenges of using AI in chip design, with Thomas Andersen, vice president for AI & Machine Learning at Synopsys; Sridhar Boinapally, senior director of analog/mixed signal tools/flow at Intel; Alex Starr, corporate fellow at AMD; Stuart Oberman, vice president for GPU hardware engineering at Nvidia; ... » read more

Preparing For The Multiphysics Future of 3D ICs
By Siemens EDA - 01 Apr, 2026 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Causal Inference for AMS Design (U. of Florida)
By Technical Paper Link - 31 Mar, 2026 - Comments: 0

A new technical paper, "Causal AI For AMS Circuit Design: Interpretable Parameter Effects Analysis," was published by the University of Florida. Abstract "Analog-mixed-signal (AMS) circuits are highly non-linear and operate on continuous real-world signals, making them far more difficult to model with data-driven AI than digital blocks. To close the gap between structured design data (dev... » read more

Status of WBG Device Reliability in Automotive (U. Bremen et al.)
By Technical Paper Link - 31 Mar, 2026 - Comments: 0

A new technical paper, "Reliability of Wide Bandgap Semiconductors for Automotive Applications," was published by the Universitat Bremen, Technische Universitat Chemnitz, BMW, Robert Bosch GmbH, Infineon, Semikron Danfoss, and FH Dortmund. Abstract "Wide bandgap (WBG) semiconductor devices offer tremendous advantages over their silicon counterparts. Automotive applications benefit particu... » read more

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