Limiting AI/ML Tools To Ensure Physical AI Safety, Security


Key Takeaways: AI-based tools can help monitor physical AI systems and LLMs, but human oversight is still needed to avoid false positives, bias, and other anomalies. For autonomous vehicles and robots, edge case scenarios and understanding human values are weak points, especially as moral and social values change over time. AI tools are growing and becoming increasingly helpful for c... » read more

The New Design Advantage: Why Unifying Processing And Connectivity Simplifies The Design Experience


Devices are becoming smarter, more capable, and more distributed, but the way we design them has not kept pace. For engineers, that progress increasingly brings tradeoffs: latency bottlenecks, rising power demands, and fragmented system architectures that complicate even well-understood designs. As functionality increases, so does the difficulty of fitting multiple analog and digital components... » read more

New Automotive Architectures Are Shaking Up Processor And Memory Choices


Key Takeaways Assisted and autonomous driving require more data from more sensors, and much faster processing of some of that data. The shift to software-defined vehicles and centralized intelligence makes it easier to identify where the most advanced processors and memories are required, and where older and less expensive technologies can be deployed. Technologies that were largely ... » read more

Edge And Micro Data Centers: Powering The Real-Time Digital World


The modern world no longer runs on delayed responses. It runs on immediacy. When a self-driving vehicle identifies a pedestrian, when a factory robot adjusts production in milliseconds, or when an augmented reality overlay appears instantly during remote surgery, there is no tolerance for latency. These applications demand data processing that happens almost at the speed of human reflexes. B... » read more

Learnings From The Polish Energy Sector Attacks


On 29 December 2025, coordinated cyberattacks targeted Polish energy infrastructure. The attacks coincided with severe winter weather and appear to have aimed at disrupting heat supply to end users by targeting renewable energy farms. The attackers succeeded in disabling controllers linking generation and distribution facilities but, thankfully, were unable to halt electricity production. Th... » read more

A Guide To Fast Switching GaN Challenges And Solutions


Gallium nitride (GaN) is an ideal material for applications requiring high switching speeds and minimal power losses. While the wide-bandgap material can certainly improve a system’s overall efficiency, it can also be more vulnerable to spurious turn-ons and other design challenges. That’s what makes top-of-the-line packaging, such as Infineon HiRel’s new PowIR-SMD, critical in space powe... » read more

RPU: A Chiplet-Based Architecture To Address The Challenges of the Modern Memory Wall (Harvard University)


Researchers from Harvard University have released “RPU -- A Reasoning Processing Unit”. Abstract “Large language model (LLM) inference performance is increasingly bottlenecked by the memory wall. While GPUs continue to scale raw compute throughput, they struggle to deliver scalable performance for memory bandwidth bound workloads. This challenge is amplified by emerging reasonin... » read more

Electronic Warfare: Vying for Control of the Electromagnetic Spectrum


Over the past decade, preeminent countries involved in major military conflicts mainly focused on asymmetrical warfare — surprise attacks by small groups armed with modern, high-tech weaponry. During that same period, however, near-peer adversaries began attaining impressive electronic warfare (EW) capabilities. As a result, a plethora of new, dynamic threats flooded the EW spectrum, pushing ... » read more

System-level Reliability Verification for 2.5D/3D ICs Using Innovator3D IC and Calibre 3DPERC


The increasing demand for higher performance, lower power, and greater functionality in smaller packages has driven the rapid adoption of 2.5D and 3D Integrated Circuits (ICs). However, the inherent complexity of these multi-die architectures presents significant reliability verification challenges that traditional 2D flows cannot adequately address, particularly concerning electrostatic discha... » read more

Tool And Methodology Changes Coming In Fab And Package Automation


Experts at the table: Semiconductor Engineering sat down to discuss what's changing in semiconductor fabs and packaging houses with Michael Lowman, senior product marketing manager for Data Analytics at Cohu; Aftkhar Aslam, CEO at yieldWerx, Woo Young Han, product marketing director at Onto Innovation; and Lihong Cao, senior director of engineering and technical marketing for ASE. What foll... » read more

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