A specialized, end-to-end approach for system-level reliability verification of advanced 2.5D and 3D IC assemblies.
The increasing demand for higher performance, lower power, and greater functionality in smaller packages has driven the rapid adoption of 2.5D and 3D Integrated Circuits (ICs). However, the inherent complexity of these multi-die architectures presents significant reliability verification challenges that traditional 2D flows cannot adequately address, particularly concerning electrostatic discharge (ESD) protection, heterogeneous die integration and inter-die connectivity.
This paper introduces a new solution from Siemens EDA: the Innovator3D IC (i3D) flow seamlessly integrated with Calibre 3DPERC. This powerful methodology provides a specialized, end-to-end approach for system-level reliability verification of advanced 2.5D and 3D IC assemblies.
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