Reverse Laser Assisted Bonding (R-LAB) Technology For Chiplet Module Bonding On Substrate

By SeokHo Na - 21 Sep, 2023 - Comments: 0

By SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park, and JinYoung Kim In the recent semiconductor market, there are many applications including smartphone, tablets, central processing units (CPUs), artificial intelligence (AI), data cloud and more that are expecting and experiencing rapid growth. As most of these applications require high performance, single-die Flip Chip packages... » read more

Why Curvy Design Now? Manufacturing Is Possible And Scaling Needs It

By Jan Willis - 21 Sep, 2023 - Comments: 1

Have you ever seen roots or tree branches take a 90-degree turn? Have you ever seen a river that takes a 90-degree turn? Nature doesn’t do 90-degree turns, or for that matter any sharp angle turns – not even 135 degrees. Yet the entire chip-design infrastructure is based on the Manhattan assumption of 90-degree turns. While it would take time to change, is there any doubt that a curvilinea... » read more

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success

By Jessica Albright - 21 Sep, 2023 - Comments: 0

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with features just a few nanometers has no margin of error. This blog shares why it’s important to detect materia... » read more

New Plasma Power Technologies For Next-Gen Semiconductor Manufacturing

By Vitaly Petrishchev - 21 Sep, 2023 - Comments: 0

As chip designs push the limits of speed, size and complexity, the semiconductor industry has set its sights on angstrom-scale device features. High-speed, precise and repeatable plasma power delivery with sophisticated controls is fundamental to process and device improvements. These factors support inflection points in technologies from chip-scale packaging through advanced front-end technolo... » read more

Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging

By Amkor - 21 Sep, 2023 - Comments: 0

Bridge technology is a promising heterogeneous integration (HI) solution for application-specific integrated circuits (ASICs) and high bandwidth memory (HBM). The bridge dies provide localized communications among the multiple system on chips (SoCs) in a single package. In Amkor's bridge technology, S-Connect provides die-to-die connections with fine pitch [1]. Prototype S-Connect technology wa... » read more

Functionalized Carbon Nanotubes Enabled Flexible And Scalable CO2 Sensors

By Brewer Science - 21 Sep, 2023 - Comments: 0

This work, we have demonstrated a low-cost and effective chemiresistive CO2 sensor based on a composite of functionalized carbon nanotubes (f-CNTs) with polyethyleneimine (PEI). The resulting sensor shows excellent selectivity and sensitivity, which can respond to the CO2 concentration in a wide range of 300 - 5000 ppm. The effects of ink dilution and humidity from the environment on the sen... » read more

Blog Review: September 20

By Jesse Allen - 20 Sep, 2023 - Comments: 0

Siemens' Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed. Synopsys' Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together. Cadence's V... » read more

Why Chiplets Don’t Work For All Designs

By Ed Sperling - 20 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Photonic-Electronic SmartNIC With Fast and Energy-Efficient Photonic Computing Cores (MIT)

By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “Lightning: A Reconfigurable Photonic-Electronic SmartNIC for Fast and Energy-Efficient Inference” was published by researchers at Massachusetts Institute of Technology (MIT). Abstract: "The massive growth of machine learning-based applications and the end of Moore's law have created a pressing need to redesign computing platforms. We propose Lightning, the first ... » read more

3D-Integrated Neuromorphic Hardware With A Two-Level Neuromorphic “Synapse Over Neuron” Structure

By Technical Paper Link - 19 Sep, 2023 - Comments: 0

A technical paper titled “3D Neuromorphic Hardware with Single Thin-Film Transistor Synapses Over Single Thin-Body Transistor Neurons by Monolithic Vertical Integration” was published by researchers at Korea Advanced Institute of Science and Technology (KAIST) and SK hynix. Abstract: "Neuromorphic hardware with a spiking neural network (SNN) can significantly enhance the energy efficiency... » read more

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