Week In Review: Auto, Security, Pervasive Computing


Automotive, Mobility The U.S. space agency NASA entered a $57.2 million contract with ICON to develop technology to build roads on the moon. ICON, a Texas-based 3D printing construction company, has been working with NASA and the U.S. Air Force on construction technologies that can use local materials to build infrastructure on Mars. NASA is working on advanced 3D printing construction systems... » read more

Week In Review: Design, Low Power


Tools and IP Renesas released a family of configurable clock generators with an internal crystal oscillator for PCIe and networking applications in high-end computing, wired infrastructure and data center equipment. “Timing needs can vary greatly between different applications and equipment, and often change during a product design cycle,” said Zaher Baidas, Vice President of the Timing Pr... » read more

An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna)


A research paper titled "HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement" was published by researchers at ETH Zurich and University of Bologna. Abstract: "2.5D integration is an important technique to tackle the growing cost of manufacturing chips in advanced technology nodes. This poses the challenge of providing high-performance inter-chiplet interconnects ... » read more

Hardware Trojans Target Coherence Systems in Chiplets (Texas A&M / NYU)


A technical paper titled "Hardware Trojan Threats to Cache Coherence in Modern 2.5D Chiplet Systems" was published by researchers at Texas A&M University and NYU. Abstract: "As industry moves toward chiplet-based designs, the insertion of hardware Trojans poses a significant threat to the security of these systems. These systems rely heavily on cache coherence for coherent data communic... » read more

HW Security: Fingerprints Of Digital Circuits Using Electromagnetic Side-Channel Sensing & Simulations (Georgia Tech)


A technical paper titled "Circuit Activity Fingerprinting Using Electromagnetic Side-Channel Sensing and Digital Circuit Simulations" was published by researchers at Georgia Tech. The work "introduces a novel circuit identification method based on “fingerprints” of periodic circuit activity that does not rely on any circuit-specific reference measurements. We capture these “fingerprint... » read more

Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton)


A technical paper titled "A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators" was published by researchers at CalTech and University of Southampton. "The resulting optimized interface between the two chips allows them to transmit 100 gigabits of data per second while producing just 2.4 pico-Joules per transmitted bit. This improves th... » read more

HW Accelerator Architecture for MI Computation With Low Latency, Energy Efficient (MIT)


A new technical paper titled "Efficient Computation of Map-scale Continuous Mutual Information on Chip in Real Time" was published by researchers at MIT. Find the technical paper here. "In this paper, we introduce a new hardware accelerator architecture for MI computation that features a low-latency, energy-efficient MI compute core and an optimized memory subsystem that provides sufficie... » read more

MAC Operation on 28nm High-k Metal Gate FeFET-based Memory Array with ADC (Fraunhofer IPMS/GF)


A technical paper titled "Demonstration of Multiply-Accumulate Operation With 28 nm FeFET Crossbar Array" was published by researchers at Fraunhofer IPMS and GlobalFoundries. Abstract "This letter reports a linear multiply-accumulate (MAC) operation conducted on a crossbar memory array based on 28nm high-k metal gate (HKMG) Complementary Metal Oxide Semiconductor (CMOS) and ferroelectric fi... » read more

Peeling The Onion Of An Automotive IC Digital Twin


This paper defines the modern digital twin in the context of the automotive industry and as it applies to the ICs being deployed therein. Additionally, it surveys the implications arising from the need to use digital twins to connect the virtual and physical worlds for semiconductor suppliers delivering the next generation of automotive capabilities. Why should I care about digital twins? T... » read more

Cybersecurity Risks Of Automotive OTA


Modern vehicles increasingly resemble supercomputers on wheels, with many electronic control units (ECUs) networked together as increasingly sophisticated software is installed and updated. Similar to smartphones, vehicle OEMs will contact vehicle owners remotely about operating system updates that add new features and/or fixes, as well as software bugs and vulnerabilities. But all of this h... » read more

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