Balancing Power And Heat In Advanced Chip Designs
By Karen Heyman - 10 Nov, 2022 - Comments: 1

Power and heat use to be someone else's problem. That's no longer the case, and the issues are spreading as more designs migrate to more advanced process nodes and different types of advanced packaging. There are a number of reasons for this shift. To begin with, there are shrinking wire diameters, thinner dielectrics, and thinner substrates. The scaling of wires requires more energy to driv... » read more

Weird Incidents Reveal L5 Challenges
By Marie C. Baca - 09 Nov, 2022 - Comments: 0

A series of surprising, counterintuitive, and sometimes bizarre incidents reveal the challenges of achieving full Level 5 autonomy in self-driving vehicles, which are an increasingly common site in major cities. While it’s easy to dismiss such anecdotes as humorous glitches compared with the sobering accounts of autonomous tech-related injuries and fatalities, industry executives say these oc... » read more

Complete Reliability Verification For Multiple-Power-Domain Designs
By Siemens EDA - 09 Nov, 2022 - Comments: 0

With increasing design complexity and a heightened focus on reliability at all levels of integrated circuit (IC) design from intellectual property (IP) to full-chip, accurate and full verification coverage of the different reliability concerns within an IC design is essential. Designs containing multiple power domains add more complexity to reliability verification with the need to validate int... » read more

Blog Review: Nov. 9
By Jesse Allen - 09 Nov, 2022 - Comments: 0

Cadence's Claire Ying finds that the latest update to CXL, which introduced memory-centric fabric architectures and expanded capabilities for improving scale and optimizing resource utilization, could change how some of the world’s largest data centers and fastest supercomputers are built. Synopsys' Gervais Fong and Morten Christiansen examine the latest updates in the USB 80Gbps specifica... » read more

Enabling Accurate Electronic-Photonic Co-Design with a Synergetic Workflow on GlobalFoundries Fotonix Platform
By Ansys - 09 Nov, 2022 - Comments: 0

Massive growth in research, development, and applications of CMOS-compatible integrated photonics in recent years, along with its expected potential for the years to come, has sparked an ever-increasing demand from designers for seamless and all-inclusive design automation solutions that can enable electronic-photonic co-design while being accurate and easy to use. Here, we demonstrate an end-t... » read more

Innovate By Customized Instructions, But Without Fragmenting The Ecosystem
By Arm - 09 Nov, 2022 - Comments: 0

This white paper reviews the design considerations for SoC designers when they deploy their hardware accelerators, and how software developers access the accelerators implemented using Arm Custom Instructions. Click here to read more. » read more

Unleash The Potential of CFD
By Cadence - 09 Nov, 2022 - Comments: 0

Classic CFD to High-Order Scalability Instead of relying on expensive prototype testing or experimentation, users now have access to numerous open-source and paid computational fluid dynamics (CFD) software that can help them solve application-specific problems. Today, CFD is no longer about getting one solution at a time; it is about getting the best possible solution from multiple design tes... » read more

How Low Can You Go? Pushing The Limits Of Transistors
By Synopsys - 09 Nov, 2022 - Comments: 0

Rising demand for cutting-edge mobile, IoT, and wearable devices, along with high compute demands for AI and 5G/6G communications, has driven the need for lower power systems-on-chip (SoCs). This is not only a concern for a device’s power consumption when active (dynamic power), but also when the device is not active (leakage power). This highly competitive industry provides significant rewar... » read more

Semiconductor Manufacturing: Tradeoffs Between Performance, Energy Consumption & Cybersecurity Controls
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new research paper titled "Simulating Energy and Security Interactions in Semiconductor Manufacturing: Insights from the Intel Minifab Model" was published by researchers at Idaho National Laboratory, University of Texas at Austin, University of Texas at San Antonio and George Mason University. Abstract: "Semiconductor manufacturing is a highly complex. Fabrication plants must deal with r... » read more

Using More Germanium In Chips for Energy Efficiency & Achievable Clock Frequencies
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Composition Dependent Electrical Transport in Si1−xGex Nanosheets with Monolithic Single-Elementary Al Contacts" was published by researchers at TU Wien (Vienna University of Technology), Johannes Kepler University, CEA-LETI, and Swiss Federal Laboratories for Materials Science and Technology. Find the technical paper here. Published September 2022. Abstrac... » read more

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