Standardizing Chiplet Interconnects


The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions and features from different vendors. The ability to choose from a menu of small, highly specialized chips, and to mix and match them for specific applications and use cases, has been on the horizon for more than a decade. ... » read more

SiPs And MCMs Broaden Opportunities For Military-Aerospace System Design


Military and aerospace (mil-aero) applications, from satellites and rockets to ships and planes, increasingly require electronic systems and subsystems with high functionality and performance in a small form factor. Meeting these demands poses higher-level challenges for packaging of these microelectronic devices, which needs to be rugged, long-lived, and affordable. Usage of multi-chip modu... » read more

Two Chip-Scale Photonic Systems For Optical Data Transmission & Microwave Photonics


New research paper "Microcomb-driven silicon photonic systems" from Peking University, UCSB, and Peng Cheng Laboratory. Abstract "Microcombs have sparked a surge of applications over the past decade, ranging from optical communications to metrology. Despite their diverse deployment, most microcomb-based systems rely on a large amount of bulky elements and equipment to fulfil their desir... » read more

Neurosynaptic Device That Mimics Synaptic and Intrinsic Plasticity Concomitantly In a Single cell


New academic paper titled "Simultaneous emulation of synaptic and intrinsic plasticity using a memristive synapse" from researchers at Korea Advanced Institute of Science and Technology (KAIST). Abstract Neuromorphic computing targets the hardware embodiment of neural network, and device implementation of individual neuron and synapse has attracted considerable attention. The emulation of... » read more

A Methodology for Automatic eFPGA redaction


New academic paper titled "ALICE: An Automatic Design Flow for eFPGA Redaction" from researchers at Politecnico di Milano, New York University, University of Calgary, and the University of Utah. Abstract "Fabricating an integrated circuit is becoming unaffordable for many semiconductor design houses. Outsourcing the fabrication to a third-party foundry requires methods to protect the intell... » read more

Week In Review: Manufacturing, Test


GlobalFoundries launched GF Labs, an “open framework of internal and external research and development initiatives that deliver a differentiated pipeline of market-driven process technology solutions for future data-centric, connected, intelligent and secure applications.” Greg Bartlett, GF's senior vice president of technology, engineering at quality, said the goal is to develop and exp... » read more

Week In Review: Design, Low Power


Cadence's digital full flow was certified for the GlobalFoundries 12LP/12LP+ process platforms. The certified tools include the Innovus Implementation System, Genus Synthesis Solution, Tempus Timing Signoff Solution, Voltus IC Power Integrity Solution, Quantus Extraction Solution, Litho Physical Analyzer (LPA), and Pegasus Verification System. Siemens Digital Industries Software's Calibre nm... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility The number new energy vehicles (NEVs) sold went up 80% from year over year, says TrendForce in its review of market for Q1 2022. NEVs are battery electric vehicles (BEVs), plug-in hybrid electric vehicles (PHEVs), and fuel cell vehicles. Over 2.004 million units sold in the first quarter of 2022 (1Q22), with BEVs making the strongest showing at 1.508 million units, a 271% ... » read more

Wafer Shortage Improvement In Sight For 300mm, But Not 200mm


The supply chain for bare wafers is off-kilter. Demand is appreciably higher than the wafer suppliers can keep up with, creating shortages that could last for years. For 300mm starting wafers, the top five big players — SEH and Sumco of Japan, Siltronic of Germany, GlobalWafers of Taiwan, and SK Siltron of Korea — finally took action over the last year, spending billions on new wafer fac... » read more

Shortages Spark Novel Component Lifecycle Solutions


The semiconductor industry’s supply chain problems are prompting some innovative solutions and workarounds, and while they don't solve all problems, they are improving efficiency and extending equipment lifetimes. The shortages, which affect everything from the chips used in automotive, IoT, and consumer ICs to the equipment used to manufacture and test them — span global supply lines. T... » read more

← Older posts Newer posts →